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10037165 |
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±Ý¼Ó À¯±â¹° ÈÇбâ»óÁõÂø ½Ã½ºÅÛ
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Metalorganic Chemical Vapor Deposition (MOVCD) System |
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Jusung Eng. |
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Eureka 2000 |
»ó¼¼Á¤º¸ |
Àåºñ»ç¾ç |
Standard process : Si Epitaxy, Si SEG, SiGe Epitaxy, SiGe SEG
Process Temperature : 700¡É
Base Presuure : under 5E-9Torr
Wafer size : up to 8inch wafer
Gases : Ar, H2, SF6, Cl2, Si2H6, GeH4, CH3SiH3, 0.5% B2H6/He, 0.5% PH3/He |
Ȱ¿ëºÐ¾ß |
An ultra clean deposition environment with minimized partial pressure of oxygen and vapor for selective epi growth
The Epi growth technology forms the epi layer selectively on the Si area except for the dielectric film pattern. |
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ÀÌÁ¤ÀÍ |
ÀüÈ |
054-279-0267 |
À̸ÞÀÏ |
kb3000@postech.ac.kr |
µ¿ÀÏ/À¯»çÀåºñÁ¤º¸ |
Àåºñ¸í |
À¯¼¼Æ÷ ºÐ¼®±â(Accuri C6 plus System) |
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BD Biosciences |
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BD Accuri¢â C6 Plus |
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202-1È£
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|
Àåºñ¸í |
[±Û·ÎÄÃ] ÆÄ¿ö·¦¾¾ µðÁöÅÐ µ¥ÀÌÅÍ ¼öÁý ½Ã½ºÅÛ([Glocal] PowerLab C Digital Data Collection System) |
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(ÁÖ)¶óÀÌÇÁÅØ |
¸ðµ¨¸í |
PowerLab C |
¼³Ä¡Àå¼Ò |
206È£
|
|
Àåºñ¸í |
PCR ½Ã½ºÅÛ(GeneAmp PCR System 9700) |
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Thermo Fisher Scientific |
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GeneAmp PCR System 9700 |
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410È£
|
|
Àåºñ¸í |
ÃÊ°í¼º´É ÀÚµ¿ ¼¼Æ÷ºÐ¼®±â(Ultra High-End Performance Flow Cytometry System) |
Á¦ÀÛ»ç |
Beckman Coulter |
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cyotoFLEX LX |
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729È£
|
|
Àåºñ¸í |
Á¶Á÷Åõ¸íȽýºÅÛ(CLARITY-Tissue Clearing system) |
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·Î°í¹ÙÀÌ¿À½Ã½ºÅÛ |
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X-clarity |
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BOIC 4210È£
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Ãʼø¼ö Á¦Á¶ÀåÄ¡(Water purification system(2,3Â÷)) |
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Merck Millipore |
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Milli-Q¢ç IQ 7015 |
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BOIC [3307È£]
|
|
Àåºñ¸í |
¹ÙÀÌ¿ÀºÐÀÚ À̹Ì¡ ½Ã½ºÅÛ(Biomolecular Imaging System) |
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GE Healthcare(Çö Cytiva) |
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Amersham Imager 600 |
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BOIC [4307È£]
|
|
Àåºñ¸í |
(GLOCAL)´ÜÀϼ¼Æ÷ À̹Ì¡ °ø°£ ºÐ¼® ½Ã½ºÅÛ(Ultra high-multiplexed single cell spatial analysis system) |
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Akoya Biosciences |
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Phenocycler-Fusion 2.0 |
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BOIC [4308È£]
|
|
Àåºñ¸í |
Ãʼø¼ö Á¦Á¶ÀåÄ¡(Water purification system(2,3Â÷)) |
Á¦ÀÛ»ç |
Merck Millipore |
¸ðµ¨¸í |
Milli-Q¢ç Q-POD¢ç |
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BOIC [4313È£]
|
|
Àåºñ¸í |
ÈÇй߱¤ À̹ÌÁö ÃøÁ¤ÀåÄ¡(Western Blot Imaging System) |
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Cytiva |
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Amersham Image Quant IQ800 |
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C5
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|
Àåºñ¸í |
°íÈ¿À² ½Ã·á°Ë»ö ½Ã½ºÅÛ(High throughput screening system) |
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Revvity |
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Fontus NGS |
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C5
|
|
Àåºñ¸í |
´ë¿ë·® Â÷¼¼´ë¿°±â¼¿ºÐ¼® ½Ã½ºÅÛ(Next-Generation Sequencing system) |
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Illumina |
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NextSeq1000 |
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C5
|
|
Àåºñ¸í |
·¹ÀÌÀú ½Ã½ºÅÛ(Tunable Laser System) |
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Amplitude |
¸ðµ¨¸í |
Surelite OPO |
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C5 228È£
|
|
Àåºñ¸í |
¿¬±¸¿ë ÃÊÀ½ÆÄ ½Ã½ºÅÛ(Research Ultrasound System) |
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Verasonics |
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VANTAGE 256 |
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C5 228È£
|
|
Àåºñ¸í |
·¡ÇÎ&Æú¸®½Ì ½Ã½ºÅÛ(Lapping & Polishing System) |
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LOGITECH |
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PM6 |
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C5 228È£
|
|
Àåºñ¸í |
ÀÓÇÇ´ø½º ÃøÁ¤Àåºñ(Impedance Analyzer System) |
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Keysight Technologies |
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E4990A |
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C5 232È£
|
|
Àåºñ¸í |
ü¿Ü »ýü Á¶Á÷ Èû ÃøÁ¤ ÀåÄ¡(Isolated Muscle System) |
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Aurora Scientific |
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1500A |
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C5 232È£
|
|
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Áø°ø ¿ÁõÂø ½Ã½ºÅÛ(Thermal Evaporating System) |
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´ëµ¿ÇÏÀÌÅØ |
¸ðµ¨¸í |
DD-GT103R |
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C5 329È£
|
|
Àåºñ¸í |
ÆÐ·²¸° ÁõÂø±â(Parylene Deposition System) |
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¿À¹æÅ×Å©³î·ÎÁö |
¸ðµ¨¸í |
OBT-PC300 |
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C5 329È£
|
|
Àåºñ¸í |
ÆÞ½º ·¹ÀÌÀú ÁõÂø ½Ã½ºÅÛ(Pulsed Laser Deposition (PLD) System) |
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ÇѺû·¹ÀÌÀú |
¸ðµ¨¸í |
GPPA-A377 |
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C5 329È£
|
|
Àåºñ¸í |
PC Á¦¾î À̹ÌÁö ÀÎ½Ä µµÆ÷ ½Ã½ºÅÛ(PC Control Image Recognition Dispensing System) |
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MUSASHI ENGINEERING, INC. |
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IMAGE MASTER 350PC SMART/SHOTMASTER 300QX |
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C5 329È£
|
|
Àåºñ¸í |
¿ø·á ÁõÂø ½Ã½ºÅÛ(Materials Deposition System with Piezoelectric Inkjet Catridge) |
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FUJIFILM |
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Dimatix DMP-2850 |
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C5 329È£
|
|
Àåºñ¸í |
¹ÝµµÃ¼ ½ºÀ§Äª ½Ã½ºÅÛ(Semiconductor Switching System) |
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KEITHLEY Instruments |
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707B |
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C5 330È£
|
|
Àåºñ¸í |
ÆÐ·²¸° ÁõÂø±â(Parylene Deposition System) |
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Specialty Coating Systems (SCS) - A KISCO Company |
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PDS Labcoter 2 (PDS 2010 LABCOTER) |
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C5 720-1È£
|
|
Àåºñ¸í |
½ºÆÛÅ͸µ ½Ã½ºÅÛ(Sputtering System) |
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JUWON TECH |
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JWMSS-200XL |
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C5 721È£
|
|
Àåºñ¸í |
3D ÇÁ¸°ÅÍ(Standalone 3D printer system) |
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3D Systems |
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Figure 4 Standalone 3D Printer |
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C5, 722È£(¹ÙÀÌ¿ÀÇコÄɾÅÍ)
|
|
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3D ±¼ÀýÇö¹Ì°æ(Low coherence holotomography systems) |
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Tomocube |
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HT-X1 |
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C5, 722È£(¹ÙÀÌ¿ÀÇコÄɾÅÍ)
|
|
Àåºñ¸í |
ÀüÀÚºö ÁõÂø±â(E-beam Evaporating System) |
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TEMESCAL/BOC COATING TECH |
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BDJ 1800 |
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LG¿¬±¸µ¿ 110È£
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|
Àåºñ¸í |
¸¶±×³×Æ®·Ð ½ºÆÛÅ͸µ Àåºñ(Magnetron Sputtering System) |
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SNTEK |
¸ðµ¨¸í |
SPR-5006 |
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LG¿¬±¸µ¿ 110È£
|
|
Àåºñ¸í |
Àç»ý ¹èÅ͸® ÆÑ Å×½ºÆ® ½Ã½ºÅÛ(Regenerative Battery Pack Test System) |
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Chroma |
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Model 17020 |
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LG¿¬±¸µ¿ 420È£
|
|
Àåºñ¸í |
¹èÅ͸® ¼¿ Ãæ¹æÀü Àåºñ(Battery Cell Charge/Discharge Test System) |
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Chroma |
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Model 17011 |
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LG¿¬±¸µ¿ 420È£
|
|
Àåºñ¸í |
´ë±âÁ¶Àý¹è¾çÀÛ¾÷´ë(Modular Atmosphere Control Workstation System) |
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Don Whitley Scientific |
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Don Whitley Scientific A55 |
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PBC 362È£
|
|
Àåºñ¸í |
°í°¨µµ PDL Ȧ ÃøÁ¤ ½Ã½ºÅÛ (High Sensitivity Parallel Dipole Line Hall System ) |
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Semilab |
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PDL 1000 |
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RIST 3µ¿ 3116/3118È£
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|
Àåºñ¸í |
Çï·ý °¡½º ȸ¼ö¿ë ÄÄÇÁ·¹¼(Helium Compressor and Filtering System) |
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Bumhan |
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BH-AL7B |
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RIST1µ¿ 1018È£
|
|
Àåºñ¸í |
¹°¸®Àû Ư¼º ÃøÁ¤ ½Ã½ºÅÛ(Physical Property Measurement System) |
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Quantum Design |
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Quantum Design PPMS |
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RIST1µ¿ 1104È£
|
|
Àåºñ¸í |
Àڱ⹰¼ºÃøÁ¤ÀåÄ¡(MAGNETIC PROPERTY MEASUREMENT SYSTEM) |
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QUANTUM DESIGN |
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XL5 |
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RIST1µ¿ 1104È£
|
|
Àåºñ¸í |
¿øÀÚÃþ ÁõÂø±â(Atomic Layer Deposition (ALD)) |
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CN1 |
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Atomic-Basic |
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RIST1µ¿ 1139È£
|
|
Àåºñ¸í |
ÀüÀÚºö ÁõÂø±â(E-beam Evaporating System) |
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Telemark |
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246-28 |
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RIST1µ¿ 1145È£
|
|
Àåºñ¸í |
À̿ ¹Ð¸µ ½Ã½ºÅÛ(Cross Section Planar Ion Milling System) |
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GATAN |
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Ilion+II Model 697 |
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RIST1µ¿ 1162È£
|
|
Àåºñ¸í |
GC/MSD ½Ã½ºÅÛ(Gas Chromatography/Mass Selective Detector (GC/MSD) System) |
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Agilent Technologies |
¸ðµ¨¸í |
7890B/5977A |
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RIST1µ¿ 1314È£
|
|
Àåºñ¸í |
GC/MSD ½Ã½ºÅÛ(Gas Chromatography/Mass Selective Detector (GC/MSD) System) |
Á¦ÀÛ»ç |
Agilent Technologies |
¸ðµ¨¸í |
7890B/5977B |
¼³Ä¡Àå¼Ò |
RIST1µ¿ 1314È£
|
|
Àåºñ¸í |
»ïÁß »ç±ØÀÚ LC/MS/MS ½Ã½ºÅÛ(Triple Quadrupole LC/MS/MS System) |
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Thermo Scientific |
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TSQ Quantum Ultra |
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RIST1µ¿ 1316È£
|
|
Àåºñ¸í |
¿Å»Âø ÃøÁ¤ ½Ã½ºÅÛ(Thermal Desorption System) |
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Markes International |
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UNITY2 |
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RIST1µ¿ 1317È£
|
|
Àåºñ¸í |
À̿ ũ·Î¸¶Åä±×·¡ÇÇ ½Ã½ºÅÛ(Ion Chromatography System) |
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Nittoseiko Analytech |
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AQF-2100H |
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RIST1µ¿ 1318È£
|
|
Àåºñ¸í |
ijÇÊ·¯¸® À̿ ũ·Î¸¶Åä±×·¡ÇÇ(Capillary Ion Chromatography System) |
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Thermo Scientific |
¸ðµ¨¸í |
Dionex ICS-5000 |
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RIST1µ¿ 1320È£
|
|
Àåºñ¸í |
¸¶ÀÌÅ©·ÎÆÄ ½Ã·á ºÐÇØ ½Ã½ºÅÛ(Advanced Microwave Digestion System) |
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Milestone |
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ETHOS 1 |
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RIST1µ¿ 1334È£
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|
Àåºñ¸í |
HPT-E-CAPº¹ÇÕÇÁ·¹½º(HPT-E-CAP Compound Press System) |
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(ÁÖ)¸ðÀνýº |
¸ðµ¨¸í |
Ư¼öÁ¦ÀÛ |
¼³Ä¡Àå¼Ò |
RIST1µ¿ 2022È£
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|
Àåºñ¸í |
ÇǷμö¸í½ÃÇè±â(Material Test System) |
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MTS |
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810 Material Test System |
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RIST2µ¿ 2193È£
|
|
Àåºñ¸í |
ÇǷμö¸í½ÃÇè±â(Material Test System) |
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MTS |
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810 Material Test System |
¼³Ä¡Àå¼Ò |
RIST3µ¿ 3003È£
|
|
Àåºñ¸í |
Áø°ø è¹ö Á¤¹Ð ºÐ¼® Àåºñ(Vacuum Chamber I-V Probing System) |
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MS TECH |
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MST5000 |
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RIST3µ¿ 3102È£
|
|
Àåºñ¸í |
ÀüÀÚºö ÁõÂø±â(E-beam Evaporating System) |
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Selcos |
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Cetus-E |
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RIST3µ¿ 3104È£
|
|
Àåºñ¸í |
¿ ÈÇÐ ±â»ó ÁõÂø ÀåÄ¡(Thermal Chemical Vapor Deposition (CVD) System) |
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SNTEK |
¸ðµ¨¸í |
TCS5000 |
¼³Ä¡Àå¼Ò |
RIST3µ¿ 3104È£
|
|
Àåºñ¸í |
Áø°ø ¿ÁõÂø ½Ã½ºÅÛ(Thermal Evaporating System) |
Á¦ÀÛ»ç |
TERALEADER |
¸ðµ¨¸í |
TLP1001 |
¼³Ä¡Àå¼Ò |
RIST3µ¿ 3139È£
|
|
Àåºñ¸í |
ÀüÀÚºö ÁõÂø±â(E-beam Evaporating System) |
Á¦ÀÛ»ç |
iNFOVION |
¸ðµ¨¸í |
- |
¼³Ä¡Àå¼Ò |
RIST3µ¿ 3147È£
|
|
Àåºñ¸í |
½Ç½Ã°£ PCR ½Ã½ºÅÛ(Real-time Polymerase Chain Reaction (PCR) System) |
Á¦ÀÛ»ç |
Roche |
¸ðµ¨¸í |
LightCycler96 |
¼³Ä¡Àå¼Ò |
RIST3µ¿ 3153È£
|
|
Àåºñ¸í |
Çü±¤/Àα¤ ÃøÁ¤ ½Ã½ºÅÛ(Fluoroscence/Luminescence Measuring System) |
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Thermo Scientific |
¸ðµ¨¸í |
Fluoroskan Ascent FL |
¼³Ä¡Àå¼Ò |
RIST3µ¿ 3161È£
|
|
Àåºñ¸í |
ºÐ±¤½Ã½ºÅÛ(Spectrometer System) |
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(ÁÖ)¿µÇ³¾¾¿¥¾¾ |
¸ðµ¨¸í |
CS-2000 |
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RIST3µ¿ 3169È£
|
|
Àåºñ¸í |
PC Á¦¾î À̹ÌÁö ÀÎ½Ä µµÆ÷ ½Ã½ºÅÛ(PC Control Image Recognition Dispensing System) |
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MUSASHI ENGINEERING, INC. |
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IMAGE MASTER 350PC SMART/SHOTMASTER 300DS-S |
¼³Ä¡Àå¼Ò |
RIST3µ¿ 3170È£
|
|
Àåºñ¸í |
¹ü¿ë ÇÁ·Îºê ½Ã½ºÅÛ(Universal Measurement Probe System) |
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TERALEADER |
¸ðµ¨¸í |
UMP100 |
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RIST3µ¿ 3170È£
|
|
Àåºñ¸í |
3D º¯ÇüÃøÁ¤½Ã½ºÅÛ(3D Deformation Analysis System) |
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GOM international AG |
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ARAMIS 12M |
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RIST3µ¿ 3188È£
|
|
Àåºñ¸í |
Àڿܼ± ÆòÇ౤ Á¶»ç ½Ã½ºÅÛ(Mask Aligner and Exposure System) |
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MIDAS SYSTEM |
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MDA-400M |
¼³Ä¡Àå¼Ò |
RIST3µ¿ 3212È£
|
|
Àåºñ¸í |
½ºÆÛÅ͸µ ½Ã½ºÅÛ(Sputtering System) |
Á¦ÀÛ»ç |
SNTEK |
¸ðµ¨¸í |
RSP-5000 |
¼³Ä¡Àå¼Ò |
RIST3µ¿ 3219È£
|
|
Àåºñ¸í |
RIE ½Ã½ºÅÛ(Reactive Ion Etching (RIE) System) |
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SNTEK |
¸ðµ¨¸í |
- |
¼³Ä¡Àå¼Ò |
RIST3µ¿ 3219È£
|
|
Àåºñ¸í |
ÇöóÁ ¿øÀÚÃþ ÁõÂø ½Ã½ºÅÛ(Plasma Enhanced Atomic Layer Deposition (PE-ALD) System) |
Á¦ÀÛ»ç |
ForALL |
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OZONE |
¼³Ä¡Àå¼Ò |
RIST3µ¿ 3223È£
|
|
Àåºñ¸í |
¹Ú¸·ÃøÁ¤±â(Thin Film Measurement System) |
Á¦ÀÛ»ç |
KSV INSTRUMENTS |
¸ðµ¨¸í |
- |
¼³Ä¡Àå¼Ò |
RIST3µ¿ 3229È£
|
|
Àåºñ¸í |
½ºÆÛÅ͸µ ½Ã½ºÅÛ(Sputtering System) |
Á¦ÀÛ»ç |
SNTEK |
¸ðµ¨¸í |
RSP-5000 |
¼³Ä¡Àå¼Ò |
RIST3µ¿ 3263È£
|
|
Àåºñ¸í |
¿¢½Ã¸Ó ·¹ÀÌÀú ½Ã½ºÅÛ(Excimer Laser System) |
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COHERENT |
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COMPex 201 F |
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RIST3µ¿ 3263È£
|
|
Àåºñ¸í |
ÆÞ½º ·¹ÀÌÀú ÁõÂø ½Ã½ºÅÛ(Pulsed Laser Deposition (PLD) System) |
Á¦ÀÛ»ç |
HIGGSLAB |
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PLD SYSTEM |
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RIST3µ¿ 3263È£
|
|
Àåºñ¸í |
Ãʰí¼Ó µðÁöÅÐ Ä«¸Þ¶ó ÀåÄ¡(High-speed Digital Camera System) |
Á¦ÀÛ»ç |
Photron Ltd. |
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FASTCAM SA1 |
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RIST3µ¿ 3267È£
|
|
Àåºñ¸í |
ºÐ±¤½Ã½ºÅÛ(Spectrometer System) |
Á¦ÀÛ»ç |
Andor Technology |
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SR-303i |
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RIST3µ¿ 3267È£
|
|
Àåºñ¸í |
Ãʰí¼Ó µðÁöÅÐ Ä«¸Þ¶ó ÀåÄ¡(High-speed Digital Camera System) |
Á¦ÀÛ»ç |
Photron Ltd. |
¸ðµ¨¸í |
FASTCAM SA2 |
¼³Ä¡Àå¼Ò |
RIST3µ¿ 3267È£
|
|
Àåºñ¸í |
ÀüÁö ¼º´É ½ÃÇè±â(Multi-cycling Battery Test System) |
Á¦ÀÛ»ç |
Korea Thermo-Tech |
¸ðµ¨¸í |
SERIES 4000 |
¼³Ä¡Àå¼Ò |
RIST3µ¿ 3278È£
|
|
Àåºñ¸í |
ÆÞ½º ·¹ÀÌÀú ÁõÂø ½Ã½ºÅÛ(Pulsed Laser Deposition (PLD) System) |
Á¦ÀÛ»ç |
COHERENT |
¸ðµ¨¸í |
COMPex Pro 102 F |
¼³Ä¡Àå¼Ò |
RIST3µ¿ 3282È£
|
|
Àåºñ¸í |
Àú¿ÂÀ¯ÁöÀåÄ¡(Cryostat System) |
Á¦ÀÛ»ç |
Oxford Instruments |
¸ðµ¨¸í |
CCC1104 |
¼³Ä¡Àå¼Ò |
RIST3µ¿ 3289È£
|
|
Àåºñ¸í |
GPC ½Ã½ºÅÛ(Gel Permeation Chromatography (GPC) System) |
Á¦ÀÛ»ç |
Waters |
¸ðµ¨¸í |
1525/2414/410 |
¼³Ä¡Àå¼Ò |
RIST3µ¿ 3312È£
|
|
Àåºñ¸í |
¹ÝµµÃ¼ Ư¼º ºÐ¼®±â(Semiconductor Characterization System) |
Á¦ÀÛ»ç |
KEITHLEY Instruments |
¸ðµ¨¸í |
4200 |
¼³Ä¡Àå¼Ò |
RIST3µ¿ 3340È£
|
|
Àåºñ¸í |
QE ÃøÁ¤±â(External and Internal Quantum Efficiency (EQE and IQE) Measurement System) |
Á¦ÀÛ»ç |
NEWPORT |
¸ðµ¨¸í |
Oriel IQE-200 |
¼³Ä¡Àå¼Ò |
RIST3µ¿ 3340È£
|
|
Àåºñ¸í |
X-¼±±¤ÀüÀںб¤ºÐ¼®±â(XPS xonnectable Deposition system) |
Á¦ÀÛ»ç |
ULVAC-PHI, Inc. |
¸ðµ¨¸í |
PHI GENESIS Multi-tech Scanning XPS |
¼³Ä¡Àå¼Ò |
RIST3µ¿ 3360/3362È£
|
|
Àåºñ¸í |
Áø°ø ¿ÁõÂø ½Ã½ºÅÛ(Vacuum Thermal Evaporating System) |
Á¦ÀÛ»ç |
WOOSUNG HI-VAC |
¸ðµ¨¸í |
- |
¼³Ä¡Àå¼Ò |
RIST3µ¿ 3363È£
|
|
Àåºñ¸í |
½Ç½Ã°£ PCR ½Ã½ºÅÛ(Real-time Polymerase Chain Reaction (PCR) System) |
Á¦ÀÛ»ç |
Roche |
¸ðµ¨¸í |
LightCycler480 |
¼³Ä¡Àå¼Ò |
°¡Å縯´ë ÀÇ»ý¸í°øÇבּ¸¼Ò
|
|
Àåºñ¸í |
À̺ÒÈÁ¦³í ½Ä°¢±â(Xenon difluoride Etching system) |
Á¦ÀÛ»ç |
¢ß½ÎÀÌ¿£ÅØ |
¸ðµ¨¸í |
Xef2 etching system |
¼³Ä¡Àå¼Ò |
±â°è½ÇÇ赿 104È£
|
|
Àåºñ¸í |
Ãʰí¼Ó µðÁöÅÐ Ä«¸Þ¶ó ÀåÄ¡(High-speed Digital Camera System) |
Á¦ÀÛ»ç |
Photron Ltd. |
¸ðµ¨¸í |
FASTCAM Mini UX100 |
¼³Ä¡Àå¼Ò |
±â°è½ÇÇ赿 108È£
|
|
Àåºñ¸í |
´ÙÀÌ¿Àµå ·¹ÀÌÁ® ½Ã½ºÅÛ(Diode Laser System) |
Á¦ÀÛ»ç |
COHERENT |
¸ðµ¨¸í |
Chameleon Vision 2 |
¼³Ä¡Àå¼Ò |
±â°è½ÇÇ赿 206È£
|
|
Àåºñ¸í |
ÆèÅäÃÊ ÆÞ½º ·¹ÀÌÀú ½Ã½ºÅÛ(Femtosecond Pulse Laser System) |
Á¦ÀÛ»ç |
COHERENT |
¸ðµ¨¸í |
Chameleon |
¼³Ä¡Àå¼Ò |
±â°è½ÇÇ赿 206È£
|
|
Àåºñ¸í |
°í¼Ó ¿ø¼ÒºÐ¼®ÀÌ °¡´ÉÇÑ Àü°è ¹æÃâÇü ÁÖ»çÀüÀÚÇö¹Ì°æ(FE-SEM with high speed EDS system) |
Á¦ÀÛ»ç |
JEOL LTD. |
¸ðµ¨¸í |
JSM-7800F Prime |
¼³Ä¡Àå¼Ò |
³ª³ëÀ¶ÇÕ±â¼ú¿ø 101È£
|
|
Àåºñ¸í |
3D Ç¥¸éÃøÁ¤ ½Ã½ºÅÛ(3D Optical Surface Metrology System) |
Á¦ÀÛ»ç |
Leica Microsystems |
¸ðµ¨¸í |
DCM 3D |
¼³Ä¡Àå¼Ò |
³ª³ëÀ¶ÇÕ±â¼ú¿ø 216È£
|
|
Àåºñ¸í |
Áø°ø ¿ÁõÂø ½Ã½ºÅÛ(Thermal Evaporating System) |
Á¦ÀÛ»ç |
DDONG High Technologies |
¸ðµ¨¸í |
Thermal Evaporator System |
¼³Ä¡Àå¼Ò |
³ª³ëÀ¶ÇÕ±â¼ú¿ø 311È£
|
|
Àåºñ¸í |
°¡½º Èñ¼® ½Ã½ºÅÛ(Computerized Gas Dilution System) |
Á¦ÀÛ»ç |
Environics |
¸ðµ¨¸í |
Series 4040 |
¼³Ä¡Àå¼Ò |
³ª³ëÀ¶ÇÕ±â¼ú¿ø 311È£
|
|
Àåºñ¸í |
À̿¿¬¸¶±â(Ion Milling System) |
Á¦ÀÛ»ç |
GL CORPORATION |
¸ðµ¨¸í |
PIPS1 691 |
¼³Ä¡Àå¼Ò |
³ª³ëÀ¶ÇÕ±â¼ú¿ø ½ÃÆíÁغñ½Ç 312È£
|
|
Àåºñ¸í |
Àú¿¡³ÊÁö À̿ ¿¬¸¶±â(Gentle Mill (Low Energy Ion Milling System)) |
Á¦ÀÛ»ç |
TechnoOrg Linda |
¸ðµ¨¸í |
IV5 |
¼³Ä¡Àå¼Ò |
³ª³ëÀ¶ÇÕ±â¼ú¿ø ½ÃÆíÁغñ½Ç 312È£
|
|
Àåºñ¸í |
ÀüÀÚºö ÁõÂø±â(E-beam Evaporating System) |
Á¦ÀÛ»ç |
Korea Vacuum Tech |
¸ðµ¨¸í |
KVE-C300160 |
¼³Ä¡Àå¼Ò |
³ª³ëÀ¶ÇÕ±â¼ú¿ø Ŭ¸°·ëµ¿ 2Ãþ Ŭ¸°·ë
|
|
Àåºñ¸í |
À¯±â¹° ÁõÂø±â(Organic Molecular Beam Deposition (OMBD) & Thermal Evaporator) |
Á¦ÀÛ»ç |
alpha-plus |
¸ðµ¨¸í |
OMBD & Thermal |
¼³Ä¡Àå¼Ò |
³ª³ëÀ¶ÇÕ±â¼ú¿ø Ŭ¸°·ëµ¿ 2Ãþ Ŭ¸°·ë
|
|
Àåºñ¸í |
¿øÀÚÃþ ÁõÂø±â(Atomic Layer Deposition (ALD)) |
Á¦ÀÛ»ç |
QUROS |
¸ðµ¨¸í |
Plus 200 |
¼³Ä¡Àå¼Ò |
³ª³ëÀ¶ÇÕ±â¼ú¿ø Ŭ¸°·ëµ¿ 2Ãþ Ŭ¸°·ë
|
|
Àåºñ¸í |
ÀüÀÚºö ÁõÂø±â(E-beam Evaporating System) |
Á¦ÀÛ»ç |
Korea Vacuum Tech |
¸ðµ¨¸í |
KVE-4000 |
¼³Ä¡Àå¼Ò |
³ª³ëÀ¶ÇÕ±â¼ú¿ø Ŭ¸°·ëµ¿ 2Ãþ Ŭ¸°·ë
|
|
Àåºñ¸í |
·¹ÀÌÀú ¸®¼Ò±×·¡ÇÇ ½Ã½ºÅÛ(Laser Lithography system) |
Á¦ÀÛ»ç |
Heidelberg Instruments |
¸ðµ¨¸í |
DWL-200 |
¼³Ä¡Àå¼Ò |
³ª³ëÀ¶ÇÕ±â¼ú¿ø Ŭ¸°·ëµ¿ 2Ãþ Ŭ¸°·ë
|
|
Àåºñ¸í |
½ºÆ®·¹½º ÃøÁ¤ ½Ã½ºÅÛ(Stress Measurement System) |
Á¦ÀÛ»ç |
FSM |
¸ðµ¨¸í |
500TC |
¼³Ä¡Àå¼Ò |
³ª³ëÀ¶ÇÕ±â¼ú¿ø Ŭ¸°·ëµ¿ 2Ãþ Ŭ¸°·ë
|
|
Àåºñ¸í |
½ºÆÛÅ͸µ ½Ã½ºÅÛ(Sputtering System) |
Á¦ÀÛ»ç |
SNTEK |
¸ðµ¨¸í |
MSS5000 |
¼³Ä¡Àå¼Ò |
³ª³ëÀ¶ÇÕ±â¼ú¿ø Ŭ¸°·ëµ¿ 2Ãþ Ŭ¸°·ë
|
|
Àåºñ¸í |
Àú¾Ð ÈÇÐÁõÂøÀåÄ¡(ÆÛ´Ï½º ŸÀÔ)(Low Pressure Chemical Vapor Deposition (LP-CVD; Furnace Type)) |
Á¦ÀÛ»ç |
(ÁÖ)À¯ÁøÅ×Å© |
¸ðµ¨¸í |
BJM100 |
¼³Ä¡Àå¼Ò |
³ª³ëÀ¶ÇÕ±â¼ú¿ø Ŭ¸°·ëµ¿ 2Ãþ Ŭ¸°·ë
|
|
Àåºñ¸í |
ÇöóÁ ÈÇÐ ±â»ó ÁõÂø±â(Plasma Enhanced Chemical Vapor Deposition (PE-CVD)) |
Á¦ÀÛ»ç |
¾ÆÅؽýºÅÛ |
¸ðµ¨¸í |
UF-CVD 200 |
¼³Ä¡Àå¼Ò |
³ª³ëÀ¶ÇÕ±â¼ú¿ø Ŭ¸°·ëµ¿ 2Ãþ Ŭ¸°·ë
|
|
Àåºñ¸í |
»ó¾Ð ÈÇбâ»óÁõÂø¹ý(Atmosphere Pressure Chemical Vapor Deposition (APCVD)) |
Á¦ÀÛ»ç |
Watkins Johnson |
¸ðµ¨¸í |
WJ-1000T |
¼³Ä¡Àå¼Ò |
³ª³ëÀ¶ÇÕ±â¼ú¿ø Ŭ¸°·ëµ¿ 2Ãþ Ŭ¸°·ë
|
|
Àåºñ¸í |
ź¼Ò³ª³ëÆ©ºê ÇÕ¼º CVD(Carbon Nanotube (CNT) Synthesis Chemical Vapor Deposition (CVD)) |
Á¦ÀÛ»ç |
¾ÆÅؽýºÅÛ |
¸ðµ¨¸í |
- |
¼³Ä¡Àå¼Ò |
³ª³ëÀ¶ÇÕ±â¼ú¿ø Ŭ¸°·ëµ¿ 2Ãþ Ŭ¸°·ë
|
|
Àåºñ¸í |
ÇöóÁ ÈÇÐ ±â»ó ÁõÂø±â(Plasma Enhanced Chemical Vapor Deposition (PE-CVD)) |
Á¦ÀÛ»ç |
BMR Technology Co. |
¸ðµ¨¸í |
HiDep-SC |
¼³Ä¡Àå¼Ò |
³ª³ëÀ¶ÇÕ±â¼ú¿ø Ŭ¸°·ëµ¿ 2Ãþ Ŭ¸°·ë
|
|
Àåºñ¸í |
½ºÆÛÅ͸µ ½Ã½ºÅÛ(Sputtering System) |
Á¦ÀÛ»ç |
AMAT |
¸ðµ¨¸í |
E5500 |
¼³Ä¡Àå¼Ò |
³ª³ëÀ¶ÇÕ±â¼ú¿ø Ŭ¸°·ëµ¿ 2Ãþ Ŭ¸°·ë
|
|
Àåºñ¸í |
ÀüÀÚºö ÁõÂø±â(E-beam Evaporating System) |
Á¦ÀÛ»ç |
Korea Vacuum Tech |
¸ðµ¨¸í |
KVE-C300160 |
¼³Ä¡Àå¼Ò |
³ª³ëÀ¶ÇÕ±â¼ú¿ø Ŭ¸°·ëµ¿ 2Ãþ Ŭ¸°·ë
|
|
Àåºñ¸í |
º¸È£¸·¿ë ÇöóÁ ÈÇÐ ±â»ó ÁõÂø±â(Plasma Enhanced Chemical Vapor Deposition (PE-CVD) for Passivation) |
Á¦ÀÛ»ç |
TES |
¸ðµ¨¸í |
TELIA200 |
¼³Ä¡Àå¼Ò |
³ª³ëÀ¶ÇÕ±â¼ú¿ø Ŭ¸°·ëµ¿ 2Ãþ Ŭ¸°·ë
|
|
Àåºñ¸í |
ÃʰíÇØ»óµµ smFRET STORM À̹Ì¡ Àåºñ(Super-resolution smFRET STORM imaging system) |
Á¦ÀÛ»ç |
ONI |
¸ðµ¨¸í |
Oxford Nanoimager S |
¼³Ä¡Àå¼Ò |
»ý¸í°øÇבּ¸¼¾ÅÍ 253È£
|
|
Àåºñ¸í |
·¹ÀÌÀú ¹Ì¼¼ ÇØºÎ ½Ã½ºÅÛ(Laser Microdissection Microscope System) |
Á¦ÀÛ»ç |
Carl Zeiss |
¸ðµ¨¸í |
PALM MicroBeam |
¼³Ä¡Àå¼Ò |
»ý¸í°øÇבּ¸¼¾ÅÍ 341È£
|
|
Àåºñ¸í |
Ź»óÇü ¸¶ÀÌÅ©·Î¾î·¹ÀÌ ½Ã½ºÅÛ(Benchtop Microarray System) |
Á¦ÀÛ»ç |
GENETIX |
¸ðµ¨¸í |
QArray mini |
¼³Ä¡Àå¼Ò |
»ý¸í°øÇבּ¸¼¾ÅÍ 458È£
|
|
Àåºñ¸í |
ÇÁ·£Ä« ¸®¼Ä¡ 3 ·Îº¿ ½Ã½ºÅÛ(FRANKA RESEARCH 3 robot system) |
Á¦ÀÛ»ç |
Franka Robotics |
¸ðµ¨¸í |
Franka Research 3 |
¼³Ä¡Àå¼Ò |
ÀΰøÁö´É¿¬±¸¿ø 142È£
|
|
Àåºñ¸í |
¸ð¼Çĸó ½Ã½ºÅÛ(Motion Capture System) |
Á¦ÀÛ»ç |
Optitrack |
¸ðµ¨¸í |
OptiTrack Motion Tracking System |
¼³Ä¡Àå¼Ò |
ÀΰøÁö´É¿¬±¸¿ø 142È£
|
|
Àåºñ¸í |
·¹ÀÌÀú ½Ã½ºÅÛ(Laser System) |
Á¦ÀÛ»ç |
KIMMON KOHA |
¸ðµ¨¸í |
IK3301R-G |
¼³Ä¡Àå¼Ò |
Á¦1°øÇаü 206È£
|
|
Àåºñ¸í |
¿¢½Ã¸Ó ·¹ÀÌÀú ½Ã½ºÅÛ(Excimer Laser System) |
Á¦ÀÛ»ç |
LAMBDA PHYSIK AG |
¸ðµ¨¸í |
Compex 205 |
¼³Ä¡Àå¼Ò |
Á¦1°øÇаü 208È£
|
|
Àåºñ¸í |
LED ÃøÁ¤ ½Ã½ºÅÛ(Wafer-level LED Measurement System) |
Á¦ÀÛ»ç |
WithLight |
¸ðµ¨¸í |
OPI-170 |
¼³Ä¡Àå¼Ò |
Á¦1°øÇаü 208È£
|
|
Àåºñ¸í |
¹ÝµµÃ¼ Ư¼º ºÐ¼®±â(Semiconductor Characterization System) |
Á¦ÀÛ»ç |
KEITHLEY Instruments |
¸ðµ¨¸í |
4200-SCS |
¼³Ä¡Àå¼Ò |
Á¦1°øÇаü 208È£
|
|
Àåºñ¸í |
ÇöóÁ ÈÇÐ ±â»ó ÁõÂø±â(Plasma Enhanced Chemical Vapor Deposition (PE-CVD)) |
Á¦ÀÛ»ç |
Korea Vacuum Tech |
¸ðµ¨¸í |
KVPED-T0583 |
¼³Ä¡Àå¼Ò |
Á¦1°øÇаü 210È£
|
|
Àåºñ¸í |
Áø°ø ¿ÁõÂø ½Ã½ºÅÛ(Thermal Evaporating System) |
Á¦ÀÛ»ç |
GD-Tech |
¸ðµ¨¸í |
KVT-2008L |
¼³Ä¡Àå¼Ò |
Á¦1°øÇаü 210È£
|
|
Àåºñ¸í |
Ãʰí¼Ó µðÁöÅÐ Ä«¸Þ¶ó ÀåÄ¡(High-speed Digital Camera System) |
Á¦ÀÛ»ç |
(ÁÖ)¾ÅÅ©·Ð |
¸ðµ¨¸í |
MotionPro Y7S1 |
¼³Ä¡Àå¼Ò |
Á¦1½ÇÇ赿 314È£
|
|
Àåºñ¸í |
ÀÔÀÚ ¿µ»ó À¯¼Ó°è(Particle Image Velocimetry (PIV) System) |
Á¦ÀÛ»ç |
TSI |
¸ðµ¨¸í |
MODULE4G-2DPIV |
¼³Ä¡Àå¼Ò |
Á¦1½ÇÇ赿 316È£
|
|
Àåºñ¸í |
À̿ ũ·Î¸¶Åä±×·¡ÇÇ ½Ã½ºÅÛ(Ion Chromatography System) |
Á¦ÀÛ»ç |
Thermo Scientific |
¸ðµ¨¸í |
DIONEX ICS-2100 |
¼³Ä¡Àå¼Ò |
Á¦1½ÇÇ赿 318È£
|
|
Àåºñ¸í |
Àç»ý ÁõÆø±â(Regenerative Amplifier System) |
Á¦ÀÛ»ç |
Spectra-Physics |
¸ðµ¨¸í |
Spitfire Ace |
¼³Ä¡Àå¼Ò |
Á¦2°øÇаü 504È£
|
|
Àåºñ¸í |
Çö¹Ì°æ Stage ¹× Á¶Àý ½Ã½ºÅÛ(Microscope Stage and Controller System) |
Á¦ÀÛ»ç |
Applied Scientific Instrumentation (ASI) |
¸ðµ¨¸í |
MS-2000 |
¼³Ä¡Àå¼Ò |
Á¦3°øÇаü 006È£
|
|
Àåºñ¸í |
¿¢½Ã¸Ó ·¹ÀÌÀú ½Ã½ºÅÛ(Excimer Laser System) |
Á¦ÀÛ»ç |
COHERENT |
¸ðµ¨¸í |
COMPex Pro |
¼³Ä¡Àå¼Ò |
Á¦3°øÇаü 206È£
|
|
Àåºñ¸í |
ÆèÅäÃÊ ÆÞ½º ·¹ÀÌÀú ½Ã½ºÅÛ(Femtosecond Pulse Laser System) |
Á¦ÀÛ»ç |
COHERENT |
¸ðµ¨¸í |
Chameleon |
¼³Ä¡Àå¼Ò |
Á¦3°øÇаü 502AÈ£
|
|
Àåºñ¸í |
¿¢½Ã¸Ó ·¹ÀÌÀú ½Ã½ºÅÛ(Excimer Laser System) |
Á¦ÀÛ»ç |
COHERENT |
¸ðµ¨¸í |
COMPex Pro 199F |
¼³Ä¡Àå¼Ò |
Á¦3°øÇаü 508È£
|
|
Àåºñ¸í |
´Ù¸ñÀû ¹Ú¸· Ç¥¸é±¸Á¶ ºÐ¼® ¿øÀÚ Çö¹Ì°æ Àåºñ(Muti-purpose Atomic Force Microscope (AFM) System) |
Á¦ÀÛ»ç |
Bruker |
¸ðµ¨¸í |
MultiMode 8 |
¼³Ä¡Àå¼Ò |
Á¦3°øÇаü 529È£
|
|
Àåºñ¸í |
32ä³Î ³úÆÄ ÃøÁ¤ ½Ã½ºÅÛ(32-Channel Electroencephalogram (EEG) Measurement System) |
Á¦ÀÛ»ç |
LAXTHA |
¸ðµ¨¸í |
LXE3232-RF |
¼³Ä¡Àå¼Ò |
Á¦4°øÇаü 005È£
|
|
Àåºñ¸í |
¹«¼± ±ÙÀüµµ ½Ã½ºÅÛ(Electromyographic (EMG) and Sensor System) |
Á¦ÀÛ»ç |
NORAXON |
¸ðµ¨¸í |
TELEMYO 2400R G2 |
¼³Ä¡Àå¼Ò |
Á¦4°øÇаü 005È£
|
|
Àåºñ¸í |
³ª³ë½Ã½º SPM Á¶Àý ½Ã½ºÅÛ(Nanonis Scanning Probe Microscopy (SPM) Control System) |
Á¦ÀÛ»ç |
SPECS |
¸ðµ¨¸í |
SPECS Nanonis Controller |
¼³Ä¡Àå¼Ò |
Á¦5°øÇаü 008È£
|
|
Àåºñ¸í |
Àç·á½ÃÇè±â(Nano Testing System) |
Á¦ÀÛ»ç |
MTS |
¸ðµ¨¸í |
Nano UTM Testing System |
¼³Ä¡Àå¼Ò |
Á¦5°øÇаü 206-1È£
|
|
Àåºñ¸í |
ÆØÃ¢°è¼ö ÃøÁ¤±â(Dilatometer System) |
Á¦ÀÛ»ç |
ERICH NETZSCH GmbH & Co. Holdi |
¸ðµ¨¸í |
DIL 402C Dilatometer |
¼³Ä¡Àå¼Ò |
Á¦5°øÇаü 206È£
|
|
Àåºñ¸í |
¸ð¼¼°üÇü°¡¿·Î(Capillary Furnace System) |
Á¦ÀÛ»ç |
Malvern Instruments |
¸ðµ¨¸í |
Rosand RH7 |
¼³Ä¡Àå¼Ò |
Á¦5°øÇаü 206È£
|
|
Àåºñ¸í |
ÆèÅäÃÊ ·¹ÀÌÀú ½Ã½ºÅÛ(Femtosecond Laser System) |
Á¦ÀÛ»ç |
COHERENT |
¸ðµ¨¸í |
Libra |
¼³Ä¡Àå¼Ò |
Á¦5°øÇаü 406È£
|
|
Àåºñ¸í |
À̿ ũ·Î¸¶Åä±×·¡ÇÇ ½Ã½ºÅÛ(Ion Chromatography System) |
Á¦ÀÛ»ç |
(ÁÖ)¼¼´ÏÁ¨ |
¸ðµ¨¸í |
Dionex Aquion IC system |
¼³Ä¡Àå¼Ò |
Áö°î¿¬±¸µ¿ 228È£
|
|
Àåºñ¸í |
µ¿Àû ±â°èÀû¹°¼º ½ÃÇè±â(Dynamic Material Testing System) |
Á¦ÀÛ»ç |
Dynamic Systems |
¸ðµ¨¸í |
GLEEBLE 3500 |
¼³Ä¡Àå¼Ò |
ö°´ëÇпø 142-4È£
|
|
Àåºñ¸í |
¸ÖƼ ½ºÄÉÀÏ ¹Ì¼¼±¸Á¶ ºÐ¼® ½Ã½ºÅÛ(Multi-scale Microstructure Analysis System) |
Á¦ÀÛ»ç |
JEOL |
¸ðµ¨¸í |
Neo-ARM |
¼³Ä¡Àå¼Ò |
ö°´ëÇпø 161È£
|
|
Àåºñ¸í |
¿Áß·®/¿·® µ¿½Ã ºÐ¼®±â(Thermal Analyzer System) |
Á¦ÀÛ»ç |
netzsch geraetebau gmbh |
¸ðµ¨¸í |
STA 449C |
¼³Ä¡Àå¼Ò |
ö°´ëÇпø 178-9È£
|
|
Àåºñ¸í |
µ¿Àû ±â°èÀû¹°¼º ½ÃÇè±â(Dynamic Material Testing System) |
Á¦ÀÛ»ç |
Dynamic Systems |
¸ðµ¨¸í |
GLEEBLE 3500 |
¼³Ä¡Àå¼Ò |
ö°´ëÇпø 242-4È£
|
|
Àåºñ¸í |
ÆØÃ¢°è¼ö ÃøÁ¤±â(Dilatometer System) |
Á¦ÀÛ»ç |
bahr-thermoanalyse gmbh |
¸ðµ¨¸í |
DIL805A/D |
¼³Ä¡Àå¼Ò |
ö°´ëÇпø 242-4È£
|
|
Àåºñ¸í |
Ç¥¸é󸮽ýºÅÛ(Target Surfacing System) |
Á¦ÀÛ»ç |
Leica Microsystems |
¸ðµ¨¸í |
EM TXP |
¼³Ä¡Àå¼Ò |
ö°´ëÇпø 250È£
|
|
Àåºñ¸í |
TEM¿ë À̿¹иµ½Ã½ºÅÛ(Ion Milling System for Transmission Electron Microscope (TEM)) |
Á¦ÀÛ»ç |
¢ßÁö¿¤ÄÚÆÛ·¹ÀÌ¼Ç |
¸ðµ¨¸í |
Gatan model 691 |
¼³Ä¡Àå¼Ò |
ö°´ëÇпø 284È£
|
|
Àåºñ¸í |
Àç·á½ÃÇè±â(Advanced Indentation System) |
Á¦ÀÛ»ç |
(ÁÖ)ÇÁ·Ðƽ½º |
¸ðµ¨¸í |
AIS2000 |
¼³Ä¡Àå¼Ò |
ö°´ëÇпø 312-4È£
|
|
Àåºñ¸í |
½ºÆÛÅÍ / Áø°øÁõÂø ÀåÄ¡(Sputtering / Vacuum Deposition System) |
Á¦ÀÛ»ç |
¾ÆÀ̾¾Æ¼ |
¸ðµ¨¸í |
Ư¼öÁ¦ÀÛ |
¼³Ä¡Àå¼Ò |
ö°´ëÇпø 374È£
|
|
Àåºñ¸í |
±Ý¼Ó Żź ¿Ã³¸® ½Ã½ºÅÛ(Tube Type Furnace System) |
Á¦ÀÛ»ç |
¢ßº£½º |
¸ðµ¨¸í |
Ư¼öÁ¦ÀÛ |
¼³Ä¡Àå¼Ò |
ö°´ëÇпø 380È£
|
|
Àåºñ¸í |
µ¿Àû ±â°èÀû¹°¼º ½ÃÇè±â(Dynamic Material Testing System) |
Á¦ÀÛ»ç |
INSTRON |
¸ðµ¨¸í |
INSTRON 8801 |
¼³Ä¡Àå¼Ò |
ö°´ëÇпø 416-8È£
|
|
Àåºñ¸í |
µ¿Àû ±â°èÀû¹°¼º ½ÃÇè±â(Dynamic Material Testing System) |
Á¦ÀÛ»ç |
INSTRON |
¸ðµ¨¸í |
INSTRON 8801 |
¼³Ä¡Àå¼Ò |
ö°´ëÇпø 416È£
|
|
Àåºñ¸í |
µ¿Àû ±â°èÀû¹°¼º ½ÃÇè±â(Dynamic Material Testing System) |
Á¦ÀÛ»ç |
INSTRON |
¸ðµ¨¸í |
INSTRON 8501 |
¼³Ä¡Àå¼Ò |
ö°´ëÇпø 431-3È£
|
|
Àåºñ¸í |
¹ü¿ë Àç·á ½ÃÇè±â(Universal Testing System) |
Á¦ÀÛ»ç |
INSTRON |
¸ðµ¨¸í |
INSTRON 3382 |
¼³Ä¡Àå¼Ò |
ö°´ëÇпø 431-3È£
|
|
Àåºñ¸í |
¼ö¼Ò·® ºÐ¼® ½Ã½ºÅÛ(Total Dissolved Solids (TDS) System for Hydrogen Analysis) |
Á¦ÀÛ»ç |
R-Dec |
¸ðµ¨¸í |
HTDS-003 |
¼³Ä¡Àå¼Ò |
ö°´ëÇпø 435-7È£
|
|
Àåºñ¸í |
¼ö¿ÇÕ¼ºÀåºñ(500 mL Stirred Autoclave System) |
Á¦ÀÛ»ç |
¢ßÀϽſÀÅäŬ·¹À̺ê |
¸ðµ¨¸í |
Ư¼öÁ¦ÀÛ |
¼³Ä¡Àå¼Ò |
ö°´ëÇпø 472È£
|
|
Àåºñ¸í |
½½·¡±×¿ëÇØ ¹× ³Ã°¢ÀåÄ¡(Slag Dissolution and Cooling System) |
Á¦ÀÛ»ç |
¸°Å×Å© |
¸ðµ¨¸í |
Ư¼öÁ¦ÀÛ |
¼³Ä¡Àå¼Ò |
ö°´ëÇпø 480È£
|
|
Àåºñ¸í |
°í¿Â°¡¿·Î(Image Furnace System) |
Á¦ÀÛ»ç |
ULVAC |
¸ðµ¨¸í |
MR-39H/D |
¼³Ä¡Àå¼Ò |
ö°´ëÇпø 546È£
|
|
Àåºñ¸í |
µµ°¡´Ï ºÎÇÏ ½Ã½ºÅÛ(1600 ¡ÆC Furnace Crucible Leading System) |
Á¦ÀÛ»ç |
Lenton |
¸ðµ¨¸í |
LTF-16/75/610 |
¼³Ä¡Àå¼Ò |
ö°´ëÇпø 546È£
|
|
Àåºñ¸í |
À̹ÌÁö½Ã½ºÅÛ(Imaging System) |
Á¦ÀÛ»ç |
Dantec Dynamics A/S |
¸ðµ¨¸í |
Advanced Imaging System |
¼³Ä¡Àå¼Ò |
ö°´ëÇпø 572È£
|
|
Àåºñ¸í |
¿ëÇØ¿ë À¯µµ°¡¿ ÀåÄ¡(Induction Heating System for Melting) |
Á¦ÀÛ»ç |
PSTEK |
¸ðµ¨¸í |
Ư¼öÁ¦ÀÛ |
¼³Ä¡Àå¼Ò |
ö°´ëÇпø 584È£
|
|
Àåºñ¸í |
Å©¸®ÇÁ ½ÃÇè±â(Lever Arm Type Creep Tester System) |
Á¦ÀÛ»ç |
ats technology, Inc |
¸ðµ¨¸í |
Series 2320 Lever Arm Tester |
¼³Ä¡Àå¼Ò |
ö°´ëÇпø B106È£
|
|
Àåºñ¸í |
½Ç½Ã°£ X-¼± °Ë»ç±â(Realtime X-ray Inspection System) |
Á¦ÀÛ»ç |
¢ßÀÚºñ½º |
¸ðµ¨¸í |
X-Scan 7950 |
¼³Ä¡Àå¼Ò |
ö°´ëÇпø ´ëÇü½ÇÇ赿
|
|
Àåºñ¸í |
½ºÆÛÅ͸µ ½Ã½ºÅÛ(Sputtering System) |
Á¦ÀÛ»ç |
¾ÆÆå½º(ÁÖ) |
¸ðµ¨¸í |
EOS-310(Á¦ÀÛǰ) |
¼³Ä¡Àå¼Ò |
Æ÷Ç×°¡¼Ó±â¿¬±¸¼Ò ÀúÀ帵µ¿ 118È£
|
|
Àåºñ¸í |
RIE ½Ã½ºÅÛ(Reactive Ion Etching (RIE) System) |
Á¦ÀÛ»ç |
(ÁÖ)¿ïÅØ |
¸ðµ¨¸í |
URS-100 |
¼³Ä¡Àå¼Ò |
Æ÷Ç×°¡¼Ó±â¿¬±¸¼Ò ÀúÀ帵µ¿ 118È£
|
|
Àåºñ¸í |
Á¡Åº¼ºÃøÁ¤±â(Rheometer system) |
Á¦ÀÛ»ç |
Ta Instruments |
¸ðµ¨¸í |
DHR-20 |
¼³Ä¡Àå¼Ò |
Æ÷Ç×½ÃÁö½Ä»ê¾÷¼¾ÅÍ wet-lab
|
|
Àåºñ¸í |
¸¶ÀÌÅ©·Î¹°¼º½ÃÇè±â(Micro-scale mechanical test system) |
Á¦ÀÛ»ç |
CellScale |
¸ðµ¨¸í |
MicrotesterG2 |
¼³Ä¡Àå¼Ò |
Æ÷Ç×½ÃÁö½Ä»ê¾÷¼¾ÅÍ wet-lab
|
|
Àåºñ¸í |
X-ray ÃøÁ¤½Ã½ºÅÛ(X-ray Measurement System) |
Á¦ÀÛ»ç |
¸ðµÎÅ×Å©³î·¯Áö, ¿ìÁ¤ÀÇ·á±â±â |
¸ðµ¨¸í |
Varian A272 |
¼³Ä¡Àå¼Ò |
dzµ¿µ¿ 108È£
|
|
Àåºñ¸í |
Àü±âÈÇÐ ºÐ¼®±â(Electrochemical Analyzer System) |
Á¦ÀÛ»ç |
Advanced Measurement Technology |
¸ðµ¨¸í |
2101A |
¼³Ä¡Àå¼Ò |
Çѱ¹·Îº¿À¶ÇÕ¿¬±¸¿ø 313È£
|
|
Àåºñ¸í |
GC/MSD ½Ã½ºÅÛ(Gas Chromatography/Mass Selective Detector (GC/MSD) System) |
Á¦ÀÛ»ç |
Agilent Technologies |
¸ðµ¨¸í |
-/5975C |
¼³Ä¡Àå¼Ò |
ȯ°æ°øÇе¿ 103/104È£
|
|
Àåºñ¸í |
°í¾Ð¿ë ºÎÇÇ½Ä ÈíÂøÀåºñ ¼ö¼Ò¿¡³ÊÁö ÀúÀå·® ÃøÁ¤ ÀÚµ¿È Àåºñ(Volumetric Sorption Measurement System) |
Á¦ÀÛ»ç |
Setaram |
¸ðµ¨¸í |
PCT Pro |
¼³Ä¡Àå¼Ò |
ȯ°æ°øÇе¿ 110È£
|
|
Àåºñ¸í |
GC/MSD ½Ã½ºÅÛ(Gas Chromatography/Mass Selective Detector (GC/MSD) System) |
Á¦ÀÛ»ç |
Agilent Technologies |
¸ðµ¨¸í |
7890B/- |
¼³Ä¡Àå¼Ò |
ȯ°æ°øÇе¿ 207È£
|
|
Àåºñ¸í |
À̿ ũ·Î¸¶Åä±×·¡ÇÇ ½Ã½ºÅÛ(Ion Chromatography System) |
Á¦ÀÛ»ç |
Metrohm |
¸ðµ¨¸í |
790 Personal IC |
¼³Ä¡Àå¼Ò |
ȯ°æ°øÇе¿ 230È£
|
|
Àåºñ¸í |
À̿ ũ·Î¸¶Åä±×·¡ÇÇ ½Ã½ºÅÛ(Ion Chromatography System) |
Á¦ÀÛ»ç |
Dionex |
¸ðµ¨¸í |
ICS-2100 |
¼³Ä¡Àå¼Ò |
ȯ°æ°øÇе¿ 302È£
|
|
Àåºñ¸í |
±¤ ¿¡³ÊÁö Àüȯ·ü ÃøÁ¤±â(Incident Photon-to-electron Conversion Efficiency (IPCE) System) |
Á¦ÀÛ»ç |
NEWPORT |
¸ðµ¨¸í |
Newport 74125 |
¼³Ä¡Àå¼Ò |
ȯ°æ°øÇе¿ 302È£
|
|
Àåºñ¸í |
·¹¿À¹ÌÅÍ(Rheometer System) |
Á¦ÀÛ»ç |
TA Instruments |
¸ðµ¨¸í |
DHR-1 |
¼³Ä¡Àå¼Ò |
ȯ°æ°øÇе¿ 303È£
|
|
Àåºñ¸í |
LC/MS/MS ½Ã½ºÅÛ(LC/MS/MS System) |
Á¦ÀÛ»ç |
Waters |
¸ðµ¨¸í |
Acquity HPLC System/TQ Detector |
¼³Ä¡Àå¼Ò |
ȯ°æ°øÇе¿ 317
|
|
Àåºñ¸í |
TFF ½Ã½ºÅÛ(Tangential Flow Filtration (TFF) System) |
Á¦ÀÛ»ç |
MERCK |
¸ðµ¨¸í |
Cogent M1 TFF System |
¼³Ä¡Àå¼Ò |
ȯ°æ°øÇе¿ 331È£
|
|
Àåºñ¸í |
ijÇÊ·¯¸® À̿ ũ·Î¸¶Åä±×·¡ÇÇ(Capillary Ion Chromatography System) |
Á¦ÀÛ»ç |
Thermo Scientific |
¸ðµ¨¸í |
Dionex ICS-5000 |
¼³Ä¡Àå¼Ò |
ȯ°æ°øÇе¿ 331È£
|
|
Àåºñ¸í |
Àڿܼ± ÆòÇ౤ Á¶»ç ½Ã½ºÅÛ(Mask Aligner and Exposure System) |
Á¦ÀÛ»ç |
PROWIN |
¸ðµ¨¸í |
M150P |
¼³Ä¡Àå¼Ò |
ȯ°æ°øÇе¿ 410È£
|
|
Àåºñ¸í |
ÀÓÇÇ´ø½º ÃøÁ¤Àåºñ(Impedance Analyzer System) |
Á¦ÀÛ»ç |
BioLogic |
¸ðµ¨¸í |
VSP-300 |
¼³Ä¡Àå¼Ò |
ȯ°æ°øÇе¿ 412È£
|
|
Àåºñ¸í |
ÀÓÇÇ´ø½º ÃøÁ¤Àåºñ(Impedance Analyzer System) |
Á¦ÀÛ»ç |
BioLogic |
¸ðµ¨¸í |
VSP-300 |
¼³Ä¡Àå¼Ò |
ȯ°æ°øÇе¿ 412È£
|
|
Àåºñ¸í |
GC/MSD ½Ã½ºÅÛ(Gas Chromatography/Mass Selective Detector (GC/MSD) System) |
Á¦ÀÛ»ç |
Agilent Techonologies |
¸ðµ¨¸í |
7890B/5977B |
¼³Ä¡Àå¼Ò |
ȯ°æ°øÇе¿ 412È£
|
|
Àåºñ¸í |
ÇÙ»ê ÃßÃâ±â(Auto Nucleic Acid Preparation System) |
Á¦ÀÛ»ç |
Precision System Science |
¸ðµ¨¸í |
Magtration System 12GC |
¼³Ä¡Àå¼Ò |
ȯ°æ°øÇе¿ 414È£
|
|
Àåºñ¸í |
À̿ ũ·Î¸¶Åä±×·¡ÇÇ ½Ã½ºÅÛ(Ion Chromatography System) |
Á¦ÀÛ»ç |
Dionex |
¸ðµ¨¸í |
ICS-1100 |
¼³Ä¡Àå¼Ò |
ȯ°æ°øÇе¿ 417È£
|