XS
SM
MD
LG
Equipment Information
»ó¾Ð È­Çбâ»óÁõÂø¹ý(Atmosphere Pressure Chemical Vapor Deposition (APCVD))
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Equip. Info.
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10072072
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Atmosphere Pressure Chemical Vapor Deposition (APCVD)
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Watkins Johnson
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WJ-1000T
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TEOS systems deposit doped or undoped silicon dioxide(SiO2) films, created from the TEOS/Ozone CVD reation.
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The film applications include shallow trench isolation, capacitor ILD, Bitline ILD, Gate ILD, Sidewall spacer, PSG passivation, IMD gap fill and capacitor core oxides.
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054-279-0267
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kb3000@postech.ac.kr
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Áø°ø ¿­ÁõÂø ½Ã½ºÅÛ(Thermal Evaporating System)
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´ëµ¿ÇÏÀÌÅØ
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DD-GT103R
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C5 329È£
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ÆÐ·²¸° ÁõÂø±â(Parylene Deposition System)
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¿À¹æÅ×Å©³î·ÎÁö
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OBT-PC300
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C5 329È£
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ÆÞ½º ·¹ÀÌÀú ÁõÂø ½Ã½ºÅÛ(Pulsed Laser Deposition (PLD) System)
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ÇѺû·¹ÀÌÀú
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GPPA-A377
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C5 329È£
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¿ø·á ÁõÂø ½Ã½ºÅÛ(Materials Deposition System with Piezoelectric Inkjet Catridge)
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FUJIFILM
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Dimatix DMP-2850
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C5 329È£
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ÆÐ·²¸° ÁõÂø±â(Parylene Deposition System)
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Specialty Coating Systems (SCS) - A KISCO Company
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PDS Labcoter 2 (PDS 2010 LABCOTER)
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C5 720-1È£
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ÀüÀÚºö ÁõÂø±â(E-beam Evaporating System)
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TEMESCAL/BOC COATING TECH
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BDJ 1800
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LG¿¬±¸µ¿ 110È£
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´ë±âÁ¶Àý¹è¾çÀÛ¾÷´ë(Modular Atmosphere Control Workstation System)
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Don Whitley Scientific
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Don Whitley Scientific A55
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PBC 362È£
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¿øÀÚÃþ ÁõÂø±â(Atomic Layer Deposition (ALD))
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CN1
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Atomic-Basic
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RIST1µ¿ 1139È£
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ÀüÀÚºö ÁõÂø±â(E-beam Evaporating System)
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Telemark
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246-28
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RIST1µ¿ 1145È£
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ÀüÀÚºö ÁõÂø±â(E-beam Evaporating System)
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Selcos
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Cetus-E
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RIST3µ¿ 3104È£
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¿­ È­ÇÐ ±â»ó ÁõÂø ÀåÄ¡(Thermal Chemical Vapor Deposition (CVD) System)
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SNTEK
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TCS5000
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RIST3µ¿ 3104È£
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Áø°ø ¿­ÁõÂø ½Ã½ºÅÛ(Thermal Evaporating System)
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TERALEADER
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TLP1001
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RIST3µ¿ 3139È£
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ÀüÀÚºö ÁõÂø±â(E-beam Evaporating System)
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iNFOVION
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-
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RIST3µ¿ 3147È£
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ÇöóÁ ¿øÀÚÃþ ÁõÂø ½Ã½ºÅÛ(Plasma Enhanced Atomic Layer Deposition (PE-ALD) System)
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ForALL
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OZONE
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RIST3µ¿ 3223È£
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ÆÞ½º ·¹ÀÌÀú ÁõÂø ½Ã½ºÅÛ(Pulsed Laser Deposition (PLD) System)
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HIGGSLAB
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PLD SYSTEM
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RIST3µ¿ 3263È£
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ÆÞ½º ·¹ÀÌÀú ÁõÂø ½Ã½ºÅÛ(Pulsed Laser Deposition (PLD) System)
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COHERENT
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COMPex Pro 102 F
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RIST3µ¿ 3282È£
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X-¼±±¤ÀüÀںб¤ºÐ¼®±â(XPS xonnectable Deposition system)
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ULVAC-PHI, Inc.
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PHI GENESIS Multi-tech Scanning XPS
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RIST3µ¿ 3360/3362È£
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Áø°ø ¿­ÁõÂø ½Ã½ºÅÛ(Vacuum Thermal Evaporating System)
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WOOSUNG HI-VAC
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-
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RIST3µ¿ 3363È£
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Áø°ø ¿­ÁõÂø ½Ã½ºÅÛ(Thermal Evaporating System)
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DDONG High Technologies
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Thermal Evaporator System
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³ª³ëÀ¶ÇÕ±â¼ú¿ø 311È£
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ÀüÀÚºö ÁõÂø±â(E-beam Evaporating System)
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Korea Vacuum Tech
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KVE-C300160
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À¯±â¹° ÁõÂø±â(Organic Molecular Beam Deposition (OMBD) & Thermal Evaporator)
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alpha-plus
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OMBD & Thermal
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³ª³ëÀ¶ÇÕ±â¼ú¿ø Ŭ¸°·ëµ¿ 2Ãþ Ŭ¸°·ë
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±Ý¼Ó À¯±â¹° È­Çбâ»óÁõÂø ½Ã½ºÅÛ(Metalorganic Chemical Vapor Deposition (MOVCD) System)
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Jusung Eng.
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Eureka 2000
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¿øÀÚÃþ ÁõÂø±â(Atomic Layer Deposition (ALD))
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QUROS
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Plus 200
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ÀüÀÚºö ÁõÂø±â(E-beam Evaporating System)
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Korea Vacuum Tech
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KVE-4000
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Àú¾Ð È­ÇÐÁõÂøÀåÄ¡(ÆÛ´Ï½º ŸÀÔ)(Low Pressure Chemical Vapor Deposition (LP-CVD; Furnace Type))
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(ÁÖ)À¯ÁøÅ×Å©
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BJM100
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ÇöóÁ È­ÇÐ ±â»ó ÁõÂø±â(Plasma Enhanced Chemical Vapor Deposition (PE-CVD))
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¾ÆÅؽýºÅÛ
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UF-CVD 200
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ź¼Ò³ª³ëÆ©ºê ÇÕ¼º CVD(Carbon Nanotube (CNT) Synthesis Chemical Vapor Deposition (CVD))
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¾ÆÅؽýºÅÛ
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-
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ÇöóÁ È­ÇÐ ±â»ó ÁõÂø±â(Plasma Enhanced Chemical Vapor Deposition (PE-CVD))
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BMR Technology Co.
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HiDep-SC
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ÀüÀÚºö ÁõÂø±â(E-beam Evaporating System)
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Korea Vacuum Tech
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KVE-C300160
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º¸È£¸·¿ë ÇöóÁ È­ÇÐ ±â»ó ÁõÂø±â(Plasma Enhanced Chemical Vapor Deposition (PE-CVD) for Passivation)
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TES
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TELIA200
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ÇöóÁ È­ÇÐ ±â»ó ÁõÂø±â(Plasma Enhanced Chemical Vapor Deposition (PE-CVD))
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Korea Vacuum Tech
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KVPED-T0583
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Á¦1°øÇаü 210È£
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Áø°ø ¿­ÁõÂø ½Ã½ºÅÛ(Thermal Evaporating System)
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GD-Tech
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KVT-2008L
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Á¦1°øÇаü 210È£
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Áø°ø-°¡¾Ð ¿ëÇØ ¹× ¿¬¼ÓÁÖÁ¶ÀåÄ¡(Vacuum-over Pressure Continuous Casting Machine)
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¢ßÄÉÀÌ¿¡ÀÌ¿¥¾ÆÀÌ
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VCC 1000 (indutherm)
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ö°­´ëÇпø 272È£
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½ºÆÛÅÍ / Áø°øÁõÂø ÀåÄ¡(Sputtering / Vacuum Deposition System)
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¾ÆÀ̾¾Æ¼
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Ư¼öÁ¦ÀÛ
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ö°­´ëÇпø 374È£
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Àü±âÈ­ÇÐ ºÐ¼®±â(Electrochemical Analyzer System)
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Advanced Measurement Technology
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2101A
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Çѱ¹·Îº¿À¶ÇÕ¿¬±¸¿ø 313È£
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400,000¿ø/Lot(25¸Å)
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2009-01-20
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URL
Ű¿öµå
AP, CVD, TEOS, PSG, SiO2, ILD, IMD
XS
SM
MD
LG
77 Cheongam-ro, Nam-gu, Pohang, Gyeongbuk, Republic of Korea (37673)
+82-54-279-3653
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