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Micro-scale mechanical test system |
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CellScale |
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MicrotesterG2 |
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Àåºñ»ç¾ç |
- ¾ÐÃà, ÀÎÀå, º¥µù ¹× Àε§Å×À̼ǽÃÇè °¡´É. Àü´Ü ½ÃÇè ¼±Åà °¡´É - 0.1µm ºÐÇØ´ÉÀÇ ÇÇ¿¡Á¶-Àü±â ¾×Ãß¿¡ÀÌÅ͸¦ »ç¿ëÇÑ ÃÖ°í ¼öÁØÀÇ Á¤¹Ðµµ - ¼¼ÄÁ Ãà À̹Ì¡°¡´É(¿É¼Ç) - ºÐÇØ´É 10nN - °íÇØ»óµµ CCD À̹Ì¡ - ÅëÇÕ ¿Âµµ Á¦¾î ¹Ìµð¾î ¼öÁ¶ - ½Ç½Ã°£ Çǵå¹éÀ» ÅëÇØ °£´ÜÇϰí ÁÖ±âÀûÀÌ¸ç ¿©À¯·Î¿î ¸ÖƼ¸ð´Þ Å×½ºÆ®¸¦ À§ÇÑ ¿Ïº®ÇÑ »ç¿ëÀÚ ÀÎÅÍÆäÀ̽º ¼ÒÇÁÆ®¿þ¾î |
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Æ÷Ç×½ÃÁö½Ä»ê¾÷¼¾ÅÍ wet-lab
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¹ÙÀÌ¿ÀÇÁ¸°ÆÃ ÀΰøÀå±â ÀÀ¿ë±â¼ú¼¾ÅÍ |
¼º¸í |
±Ç¹ÎÁö |
ÀüÈ |
054-260-2840 |
À̸ÞÀÏ |
minji00@postech.ac.kr |
µ¿ÀÏ/À¯»çÀåºñÁ¤º¸ |
Àåºñ¸í |
À¯¼¼Æ÷ ºÐ¼®±â(Accuri C6 plus System) |
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BD Biosciences |
¸ðµ¨¸í |
BD Accuri¢â C6 Plus |
¼³Ä¡Àå¼Ò |
202-1È£
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|
Àåºñ¸í |
[±Û·ÎÄÃ] ÆÄ¿ö·¦¾¾ µðÁöÅÐ µ¥ÀÌÅÍ ¼öÁý ½Ã½ºÅÛ([Glocal] PowerLab C Digital Data Collection System) |
Á¦ÀÛ»ç |
(ÁÖ)¶óÀÌÇÁÅØ |
¸ðµ¨¸í |
PowerLab C |
¼³Ä¡Àå¼Ò |
206È£
|
|
Àåºñ¸í |
PCR ½Ã½ºÅÛ(GeneAmp PCR System 9700) |
Á¦ÀÛ»ç |
Thermo Fisher Scientific |
¸ðµ¨¸í |
GeneAmp PCR System 9700 |
¼³Ä¡Àå¼Ò |
410È£
|
|
Àåºñ¸í |
ÃÊ°í¼º´É ÀÚµ¿ ¼¼Æ÷ºÐ¼®±â(Ultra High-End Performance Flow Cytometry System) |
Á¦ÀÛ»ç |
Beckman Coulter |
¸ðµ¨¸í |
cyotoFLEX LX |
¼³Ä¡Àå¼Ò |
729È£
|
|
Àåºñ¸í |
Á¶Á÷Åõ¸íȽýºÅÛ(CLARITY-Tissue Clearing system) |
Á¦ÀÛ»ç |
·Î°í¹ÙÀÌ¿À½Ã½ºÅÛ |
¸ðµ¨¸í |
X-clarity |
¼³Ä¡Àå¼Ò |
BOIC 4210È£
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|
Àåºñ¸í |
Ãʼø¼ö Á¦Á¶ÀåÄ¡(Water purification system(2,3Â÷)) |
Á¦ÀÛ»ç |
Merck Millipore |
¸ðµ¨¸í |
Milli-Q¢ç IQ 7015 |
¼³Ä¡Àå¼Ò |
BOIC [3307È£]
|
|
Àåºñ¸í |
¹ÙÀÌ¿ÀºÐÀÚ À̹Ì¡ ½Ã½ºÅÛ(Biomolecular Imaging System) |
Á¦ÀÛ»ç |
GE Healthcare(Çö Cytiva) |
¸ðµ¨¸í |
Amersham Imager 600 |
¼³Ä¡Àå¼Ò |
BOIC [4307È£]
|
|
Àåºñ¸í |
(GLOCAL)´ÜÀϼ¼Æ÷ À̹Ì¡ °ø°£ ºÐ¼® ½Ã½ºÅÛ(Ultra high-multiplexed single cell spatial analysis system) |
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Akoya Biosciences |
¸ðµ¨¸í |
Phenocycler-Fusion 2.0 |
¼³Ä¡Àå¼Ò |
BOIC [4308È£]
|
|
Àåºñ¸í |
Ãʼø¼ö Á¦Á¶ÀåÄ¡(Water purification system(2,3Â÷)) |
Á¦ÀÛ»ç |
Merck Millipore |
¸ðµ¨¸í |
Milli-Q¢ç Q-POD¢ç |
¼³Ä¡Àå¼Ò |
BOIC [4313È£]
|
|
Àåºñ¸í |
ÈÇй߱¤ À̹ÌÁö ÃøÁ¤ÀåÄ¡(Western Blot Imaging System) |
Á¦ÀÛ»ç |
Cytiva |
¸ðµ¨¸í |
Amersham Image Quant IQ800 |
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C5
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|
Àåºñ¸í |
°íÈ¿À² ½Ã·á°Ë»ö ½Ã½ºÅÛ(High throughput screening system) |
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Revvity |
¸ðµ¨¸í |
Fontus NGS |
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C5
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|
Àåºñ¸í |
´ë¿ë·® Â÷¼¼´ë¿°±â¼¿ºÐ¼® ½Ã½ºÅÛ(Next-Generation Sequencing system) |
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Illumina |
¸ðµ¨¸í |
NextSeq1000 |
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C5
|
|
Àåºñ¸í |
·¹ÀÌÀú ½Ã½ºÅÛ(Tunable Laser System) |
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Amplitude |
¸ðµ¨¸í |
Surelite OPO |
¼³Ä¡Àå¼Ò |
C5 228È£
|
|
Àåºñ¸í |
¿¬±¸¿ë ÃÊÀ½ÆÄ ½Ã½ºÅÛ(Research Ultrasound System) |
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Verasonics |
¸ðµ¨¸í |
VANTAGE 256 |
¼³Ä¡Àå¼Ò |
C5 228È£
|
|
Àåºñ¸í |
·¡ÇÎ&Æú¸®½Ì ½Ã½ºÅÛ(Lapping & Polishing System) |
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LOGITECH |
¸ðµ¨¸í |
PM6 |
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C5 228È£
|
|
Àåºñ¸í |
ÀÓÇÇ´ø½º ÃøÁ¤Àåºñ(Impedance Analyzer System) |
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Keysight Technologies |
¸ðµ¨¸í |
E4990A |
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C5 232È£
|
|
Àåºñ¸í |
ü¿Ü »ýü Á¶Á÷ Èû ÃøÁ¤ ÀåÄ¡(Isolated Muscle System) |
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Aurora Scientific |
¸ðµ¨¸í |
1500A |
¼³Ä¡Àå¼Ò |
C5 232È£
|
|
Àåºñ¸í |
Áø°ø ¿ÁõÂø ½Ã½ºÅÛ(Thermal Evaporating System) |
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´ëµ¿ÇÏÀÌÅØ |
¸ðµ¨¸í |
DD-GT103R |
¼³Ä¡Àå¼Ò |
C5 329È£
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|
Àåºñ¸í |
ÆÐ·²¸° ÁõÂø±â(Parylene Deposition System) |
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¿À¹æÅ×Å©³î·ÎÁö |
¸ðµ¨¸í |
OBT-PC300 |
¼³Ä¡Àå¼Ò |
C5 329È£
|
|
Àåºñ¸í |
ÆÞ½º ·¹ÀÌÀú ÁõÂø ½Ã½ºÅÛ(Pulsed Laser Deposition (PLD) System) |
Á¦ÀÛ»ç |
ÇѺû·¹ÀÌÀú |
¸ðµ¨¸í |
GPPA-A377 |
¼³Ä¡Àå¼Ò |
C5 329È£
|
|
Àåºñ¸í |
PC Á¦¾î À̹ÌÁö ÀÎ½Ä µµÆ÷ ½Ã½ºÅÛ(PC Control Image Recognition Dispensing System) |
Á¦ÀÛ»ç |
MUSASHI ENGINEERING, INC. |
¸ðµ¨¸í |
IMAGE MASTER 350PC SMART/SHOTMASTER 300QX |
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C5 329È£
|
|
Àåºñ¸í |
¿ø·á ÁõÂø ½Ã½ºÅÛ(Materials Deposition System with Piezoelectric Inkjet Catridge) |
Á¦ÀÛ»ç |
FUJIFILM |
¸ðµ¨¸í |
Dimatix DMP-2850 |
¼³Ä¡Àå¼Ò |
C5 329È£
|
|
Àåºñ¸í |
¹ÝµµÃ¼ ½ºÀ§Äª ½Ã½ºÅÛ(Semiconductor Switching System) |
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KEITHLEY Instruments |
¸ðµ¨¸í |
707B |
¼³Ä¡Àå¼Ò |
C5 330È£
|
|
Àåºñ¸í |
ÆÐ·²¸° ÁõÂø±â(Parylene Deposition System) |
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Specialty Coating Systems (SCS) - A KISCO Company |
¸ðµ¨¸í |
PDS Labcoter 2 (PDS 2010 LABCOTER) |
¼³Ä¡Àå¼Ò |
C5 720-1È£
|
|
Àåºñ¸í |
½ºÆÛÅ͸µ ½Ã½ºÅÛ(Sputtering System) |
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JUWON TECH |
¸ðµ¨¸í |
JWMSS-200XL |
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C5 721È£
|
|
Àåºñ¸í |
3D ÇÁ¸°ÅÍ(Standalone 3D printer system) |
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3D Systems |
¸ðµ¨¸í |
Figure 4 Standalone 3D Printer |
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C5, 722È£(¹ÙÀÌ¿ÀÇコÄɾÅÍ)
|
|
Àåºñ¸í |
3D ±¼ÀýÇö¹Ì°æ(Low coherence holotomography systems) |
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Tomocube |
¸ðµ¨¸í |
HT-X1 |
¼³Ä¡Àå¼Ò |
C5, 722È£(¹ÙÀÌ¿ÀÇコÄɾÅÍ)
|
|
Àåºñ¸í |
ÀüÀÚºö ÁõÂø±â(E-beam Evaporating System) |
Á¦ÀÛ»ç |
TEMESCAL/BOC COATING TECH |
¸ðµ¨¸í |
BDJ 1800 |
¼³Ä¡Àå¼Ò |
LG¿¬±¸µ¿ 110È£
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|
Àåºñ¸í |
¸¶±×³×Æ®·Ð ½ºÆÛÅ͸µ Àåºñ(Magnetron Sputtering System) |
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SNTEK |
¸ðµ¨¸í |
SPR-5006 |
¼³Ä¡Àå¼Ò |
LG¿¬±¸µ¿ 110È£
|
|
Àåºñ¸í |
Bit ¿¡·¯À² Å×½ºÅÍ(Bit Error Tester) |
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TEKTRONICS INC |
¸ðµ¨¸í |
GB1400 |
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LG¿¬±¸µ¿ 202È£
|
|
Àåºñ¸í |
Àç»ý ¹èÅ͸® ÆÑ Å×½ºÆ® ½Ã½ºÅÛ(Regenerative Battery Pack Test System) |
Á¦ÀÛ»ç |
Chroma |
¸ðµ¨¸í |
Model 17020 |
¼³Ä¡Àå¼Ò |
LG¿¬±¸µ¿ 420È£
|
|
Àåºñ¸í |
¹èÅ͸® ¼¿ Ãæ¹æÀü Àåºñ(Battery Cell Charge/Discharge Test System) |
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Chroma |
¸ðµ¨¸í |
Model 17011 |
¼³Ä¡Àå¼Ò |
LG¿¬±¸µ¿ 420È£
|
|
Àåºñ¸í |
´ë±âÁ¶Àý¹è¾çÀÛ¾÷´ë(Modular Atmosphere Control Workstation System) |
Á¦ÀÛ»ç |
Don Whitley Scientific |
¸ðµ¨¸í |
Don Whitley Scientific A55 |
¼³Ä¡Àå¼Ò |
PBC 362È£
|
|
Àåºñ¸í |
°í°¨µµ PDL Ȧ ÃøÁ¤ ½Ã½ºÅÛ (High Sensitivity Parallel Dipole Line Hall System ) |
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Semilab |
¸ðµ¨¸í |
PDL 1000 |
¼³Ä¡Àå¼Ò |
RIST 3µ¿ 3116/3118È£
|
|
Àåºñ¸í |
Çï·ý °¡½º ȸ¼ö¿ë ÄÄÇÁ·¹¼(Helium Compressor and Filtering System) |
Á¦ÀÛ»ç |
Bumhan |
¸ðµ¨¸í |
BH-AL7B |
¼³Ä¡Àå¼Ò |
RIST1µ¿ 1018È£
|
|
Àåºñ¸í |
¹°¸®Àû Ư¼º ÃøÁ¤ ½Ã½ºÅÛ(Physical Property Measurement System) |
Á¦ÀÛ»ç |
Quantum Design |
¸ðµ¨¸í |
Quantum Design PPMS |
¼³Ä¡Àå¼Ò |
RIST1µ¿ 1104È£
|
|
Àåºñ¸í |
Àڱ⹰¼ºÃøÁ¤ÀåÄ¡(MAGNETIC PROPERTY MEASUREMENT SYSTEM) |
Á¦ÀÛ»ç |
QUANTUM DESIGN |
¸ðµ¨¸í |
XL5 |
¼³Ä¡Àå¼Ò |
RIST1µ¿ 1104È£
|
|
Àåºñ¸í |
ÀüÀÚºö ÁõÂø±â(E-beam Evaporating System) |
Á¦ÀÛ»ç |
Telemark |
¸ðµ¨¸í |
246-28 |
¼³Ä¡Àå¼Ò |
RIST1µ¿ 1145È£
|
|
Àåºñ¸í |
À̿ ¹Ð¸µ ½Ã½ºÅÛ(Cross Section Planar Ion Milling System) |
Á¦ÀÛ»ç |
GATAN |
¸ðµ¨¸í |
Ilion+II Model 697 |
¼³Ä¡Àå¼Ò |
RIST1µ¿ 1162È£
|
|
Àåºñ¸í |
Rockwell °æµµ±â(Rockwell Hardness Testing Machine) |
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Akashi |
¸ðµ¨¸í |
Wizhard |
¼³Ä¡Àå¼Ò |
RIST1µ¿ 1188È£
|
|
Àåºñ¸í |
Vickers °æµµ±â(Vickers Hardness Testing Machine) |
Á¦ÀÛ»ç |
Mitutoyo |
¸ðµ¨¸í |
HV-114 |
¼³Ä¡Àå¼Ò |
RIST1µ¿ 1188È£
|
|
Àåºñ¸í |
°¡½ººÎ½Ä½ÃÇè±â(Gas Corrosion Test Instrument) |
Á¦ÀÛ»ç |
SUGA |
¸ðµ¨¸í |
GT-100 |
¼³Ä¡Àå¼Ò |
RIST1µ¿ 1272È£
|
|
Àåºñ¸í |
GC/MSD ½Ã½ºÅÛ(Gas Chromatography/Mass Selective Detector (GC/MSD) System) |
Á¦ÀÛ»ç |
Agilent Technologies |
¸ðµ¨¸í |
7890B/5977A |
¼³Ä¡Àå¼Ò |
RIST1µ¿ 1314È£
|
|
Àåºñ¸í |
GC/MSD ½Ã½ºÅÛ(Gas Chromatography/Mass Selective Detector (GC/MSD) System) |
Á¦ÀÛ»ç |
Agilent Technologies |
¸ðµ¨¸í |
7890B/5977B |
¼³Ä¡Àå¼Ò |
RIST1µ¿ 1314È£
|
|
Àåºñ¸í |
»ïÁß »ç±ØÀÚ LC/MS/MS ½Ã½ºÅÛ(Triple Quadrupole LC/MS/MS System) |
Á¦ÀÛ»ç |
Thermo Scientific |
¸ðµ¨¸í |
TSQ Quantum Ultra |
¼³Ä¡Àå¼Ò |
RIST1µ¿ 1316È£
|
|
Àåºñ¸í |
¿Å»Âø ÃøÁ¤ ½Ã½ºÅÛ(Thermal Desorption System) |
Á¦ÀÛ»ç |
Markes International |
¸ðµ¨¸í |
UNITY2 |
¼³Ä¡Àå¼Ò |
RIST1µ¿ 1317È£
|
|
Àåºñ¸í |
À̿ ũ·Î¸¶Åä±×·¡ÇÇ ½Ã½ºÅÛ(Ion Chromatography System) |
Á¦ÀÛ»ç |
Nittoseiko Analytech |
¸ðµ¨¸í |
AQF-2100H |
¼³Ä¡Àå¼Ò |
RIST1µ¿ 1318È£
|
|
Àåºñ¸í |
ijÇÊ·¯¸® À̿ ũ·Î¸¶Åä±×·¡ÇÇ(Capillary Ion Chromatography System) |
Á¦ÀÛ»ç |
Thermo Scientific |
¸ðµ¨¸í |
Dionex ICS-5000 |
¼³Ä¡Àå¼Ò |
RIST1µ¿ 1320È£
|
|
Àåºñ¸í |
¸¶ÀÌÅ©·ÎÆÄ ½Ã·á ºÐÇØ ½Ã½ºÅÛ(Advanced Microwave Digestion System) |
Á¦ÀÛ»ç |
Milestone |
¸ðµ¨¸í |
ETHOS 1 |
¼³Ä¡Àå¼Ò |
RIST1µ¿ 1334È£
|
|
Àåºñ¸í |
HPT-E-CAPº¹ÇÕÇÁ·¹½º(HPT-E-CAP Compound Press System) |
Á¦ÀÛ»ç |
(ÁÖ)¸ðÀνýº |
¸ðµ¨¸í |
Ư¼öÁ¦ÀÛ |
¼³Ä¡Àå¼Ò |
RIST1µ¿ 2022È£
|
|
Àåºñ¸í |
ÇǷνÃÇè±â(Fatigue Testing Machine) |
Á¦ÀÛ»ç |
MTS |
¸ðµ¨¸í |
MTS Landmark Servohydraulic Test System |
¼³Ä¡Àå¼Ò |
RIST2µ¿ 2180È£
|
|
Àåºñ¸í |
ÇǷνÃÇè±â(Fatigue Testing Machine) |
Á¦ÀÛ»ç |
MTS |
¸ðµ¨¸í |
MTS Landmark Servohydraulic Test System |
¼³Ä¡Àå¼Ò |
RIST2µ¿ 2187È£
|
|
Àåºñ¸í |
ÇǷμö¸í½ÃÇè±â(Material Test System) |
Á¦ÀÛ»ç |
MTS |
¸ðµ¨¸í |
810 Material Test System |
¼³Ä¡Àå¼Ò |
RIST2µ¿ 2193È£
|
|
Àåºñ¸í |
ÇǷνÃÇè±â(Fatigue Testing Machine) |
Á¦ÀÛ»ç |
MTS |
¸ðµ¨¸í |
MTS Landmark Servohydraulic Test System |
¼³Ä¡Àå¼Ò |
RIST2µ¿ 2195È£
|
|
Àåºñ¸í |
ÇǷμö¸í½ÃÇè±â(Material Test System) |
Á¦ÀÛ»ç |
MTS |
¸ðµ¨¸í |
810 Material Test System |
¼³Ä¡Àå¼Ò |
RIST3µ¿ 3003È£
|
|
Àåºñ¸í |
CASS ½ÃÇè±â(CASS Test Instrument) |
Á¦ÀÛ»ç |
SUGA |
¸ðµ¨¸í |
CAP-90V-5 |
¼³Ä¡Àå¼Ò |
RIST3µ¿ 3010È£
|
|
Àåºñ¸í |
º¹ÇÕ ºÎ½Ä ½ÃÇè±â(Cyclic Corrosion Tester) |
Á¦ÀÛ»ç |
Q-LAB |
¸ðµ¨¸í |
Q-FOG CCT 1100 |
¼³Ä¡Àå¼Ò |
RIST3µ¿ 3011È£
|
|
Àåºñ¸í |
º¹ÇÕ »çÀÌŬ ½ÃÇè±â(Cyclic Corrosion Test Chamber) |
Á¦ÀÛ»ç |
Ascott Analytical |
¸ðµ¨¸í |
CC1000iP |
¼³Ä¡Àå¼Ò |
RIST3µ¿ 3016È£
|
|
Àåºñ¸í |
º¹ÇÕ ºÎ½Ä ½ÃÇè±â(Cyclic Corrosion Tester) |
Á¦ÀÛ»ç |
Q-LAB |
¸ðµ¨¸í |
Q-FOG CCT 1100 |
¼³Ä¡Àå¼Ò |
RIST3µ¿ 3016È£
|
|
Àåºñ¸í |
QUVÃËÁø ³»Èļº ½ÃÇè±â(QUV Accelerated Weathering Tester) |
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Q-LAB |
¸ðµ¨¸í |
QUV/spray |
¼³Ä¡Àå¼Ò |
RIST3µ¿ 3018È£
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Àåºñ¸í |
Áø°ø è¹ö Á¤¹Ð ºÐ¼® Àåºñ(Vacuum Chamber I-V Probing System) |
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MS TECH |
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MST5000 |
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RIST3µ¿ 3102È£
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Àåºñ¸í |
ÀüÀÚºö ÁõÂø±â(E-beam Evaporating System) |
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Selcos |
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Cetus-E |
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RIST3µ¿ 3104È£
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|
Àåºñ¸í |
¿ ÈÇÐ ±â»ó ÁõÂø ÀåÄ¡(Thermal Chemical Vapor Deposition (CVD) System) |
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SNTEK |
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TCS5000 |
¼³Ä¡Àå¼Ò |
RIST3µ¿ 3104È£
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|
Àåºñ¸í |
Áø°ø ¿ÁõÂø ½Ã½ºÅÛ(Thermal Evaporating System) |
Á¦ÀÛ»ç |
TERALEADER |
¸ðµ¨¸í |
TLP1001 |
¼³Ä¡Àå¼Ò |
RIST3µ¿ 3139È£
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|
Àåºñ¸í |
ÀüÀÚºö ÁõÂø±â(E-beam Evaporating System) |
Á¦ÀÛ»ç |
iNFOVION |
¸ðµ¨¸í |
- |
¼³Ä¡Àå¼Ò |
RIST3µ¿ 3147È£
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|
Àåºñ¸í |
½Ç½Ã°£ PCR ½Ã½ºÅÛ(Real-time Polymerase Chain Reaction (PCR) System) |
Á¦ÀÛ»ç |
Roche |
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LightCycler96 |
¼³Ä¡Àå¼Ò |
RIST3µ¿ 3153È£
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|
Àåºñ¸í |
Çü±¤/Àα¤ ÃøÁ¤ ½Ã½ºÅÛ(Fluoroscence/Luminescence Measuring System) |
Á¦ÀÛ»ç |
Thermo Scientific |
¸ðµ¨¸í |
Fluoroskan Ascent FL |
¼³Ä¡Àå¼Ò |
RIST3µ¿ 3161È£
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|
Àåºñ¸í |
ºÐ±¤½Ã½ºÅÛ(Spectrometer System) |
Á¦ÀÛ»ç |
(ÁÖ)¿µÇ³¾¾¿¥¾¾ |
¸ðµ¨¸í |
CS-2000 |
¼³Ä¡Àå¼Ò |
RIST3µ¿ 3169È£
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|
Àåºñ¸í |
PC Á¦¾î À̹ÌÁö ÀÎ½Ä µµÆ÷ ½Ã½ºÅÛ(PC Control Image Recognition Dispensing System) |
Á¦ÀÛ»ç |
MUSASHI ENGINEERING, INC. |
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IMAGE MASTER 350PC SMART/SHOTMASTER 300DS-S |
¼³Ä¡Àå¼Ò |
RIST3µ¿ 3170È£
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|
Àåºñ¸í |
¹ü¿ë ÇÁ·Îºê ½Ã½ºÅÛ(Universal Measurement Probe System) |
Á¦ÀÛ»ç |
TERALEADER |
¸ðµ¨¸í |
UMP100 |
¼³Ä¡Àå¼Ò |
RIST3µ¿ 3170È£
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|
Àåºñ¸í |
3D º¯ÇüÃøÁ¤½Ã½ºÅÛ(3D Deformation Analysis System) |
Á¦ÀÛ»ç |
GOM international AG |
¸ðµ¨¸í |
ARAMIS 12M |
¼³Ä¡Àå¼Ò |
RIST3µ¿ 3188È£
|
|
Àåºñ¸í |
¸¸´É ½ÃÇè±â(Micro Universal Testing Machine (UTM)) |
Á¦ÀÛ»ç |
R&B |
¸ðµ¨¸í |
RB 302 ML |
¼³Ä¡Àå¼Ò |
RIST3µ¿ 3188È£
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|
Àåºñ¸í |
Àڿܼ± ÆòÇ౤ Á¶»ç ½Ã½ºÅÛ(Mask Aligner and Exposure System) |
Á¦ÀÛ»ç |
MIDAS SYSTEM |
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MDA-400M |
¼³Ä¡Àå¼Ò |
RIST3µ¿ 3212È£
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Àåºñ¸í |
½ºÆÛÅ͸µ ½Ã½ºÅÛ(Sputtering System) |
Á¦ÀÛ»ç |
SNTEK |
¸ðµ¨¸í |
RSP-5000 |
¼³Ä¡Àå¼Ò |
RIST3µ¿ 3219È£
|
|
Àåºñ¸í |
RIE ½Ã½ºÅÛ(Reactive Ion Etching (RIE) System) |
Á¦ÀÛ»ç |
SNTEK |
¸ðµ¨¸í |
- |
¼³Ä¡Àå¼Ò |
RIST3µ¿ 3219È£
|
|
Àåºñ¸í |
ÇöóÁ ¿øÀÚÃþ ÁõÂø ½Ã½ºÅÛ(Plasma Enhanced Atomic Layer Deposition (PE-ALD) System) |
Á¦ÀÛ»ç |
ForALL |
¸ðµ¨¸í |
OZONE |
¼³Ä¡Àå¼Ò |
RIST3µ¿ 3223È£
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|
Àåºñ¸í |
¹Ú¸·ÃøÁ¤±â(Thin Film Measurement System) |
Á¦ÀÛ»ç |
KSV INSTRUMENTS |
¸ðµ¨¸í |
- |
¼³Ä¡Àå¼Ò |
RIST3µ¿ 3229È£
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|
Àåºñ¸í |
½ºÆÛÅ͸µ ½Ã½ºÅÛ(Sputtering System) |
Á¦ÀÛ»ç |
SNTEK |
¸ðµ¨¸í |
RSP-5000 |
¼³Ä¡Àå¼Ò |
RIST3µ¿ 3263È£
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|
Àåºñ¸í |
¿¢½Ã¸Ó ·¹ÀÌÀú ½Ã½ºÅÛ(Excimer Laser System) |
Á¦ÀÛ»ç |
COHERENT |
¸ðµ¨¸í |
COMPex 201 F |
¼³Ä¡Àå¼Ò |
RIST3µ¿ 3263È£
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|
Àåºñ¸í |
ÆÞ½º ·¹ÀÌÀú ÁõÂø ½Ã½ºÅÛ(Pulsed Laser Deposition (PLD) System) |
Á¦ÀÛ»ç |
HIGGSLAB |
¸ðµ¨¸í |
PLD SYSTEM |
¼³Ä¡Àå¼Ò |
RIST3µ¿ 3263È£
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|
Àåºñ¸í |
Ãʰí¼Ó µðÁöÅÐ Ä«¸Þ¶ó ÀåÄ¡(High-speed Digital Camera System) |
Á¦ÀÛ»ç |
Photron Ltd. |
¸ðµ¨¸í |
FASTCAM SA1 |
¼³Ä¡Àå¼Ò |
RIST3µ¿ 3267È£
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|
Àåºñ¸í |
ºÐ±¤½Ã½ºÅÛ(Spectrometer System) |
Á¦ÀÛ»ç |
Andor Technology |
¸ðµ¨¸í |
SR-303i |
¼³Ä¡Àå¼Ò |
RIST3µ¿ 3267È£
|
|
Àåºñ¸í |
Ãʰí¼Ó µðÁöÅÐ Ä«¸Þ¶ó ÀåÄ¡(High-speed Digital Camera System) |
Á¦ÀÛ»ç |
Photron Ltd. |
¸ðµ¨¸í |
FASTCAM SA2 |
¼³Ä¡Àå¼Ò |
RIST3µ¿ 3267È£
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|
Àåºñ¸í |
ÀüÁö ¼º´É ½ÃÇè±â(Multi-cycling Battery Test System) |
Á¦ÀÛ»ç |
Korea Thermo-Tech |
¸ðµ¨¸í |
SERIES 4000 |
¼³Ä¡Àå¼Ò |
RIST3µ¿ 3278È£
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|
Àåºñ¸í |
ÆÞ½º ·¹ÀÌÀú ÁõÂø ½Ã½ºÅÛ(Pulsed Laser Deposition (PLD) System) |
Á¦ÀÛ»ç |
COHERENT |
¸ðµ¨¸í |
COMPex Pro 102 F |
¼³Ä¡Àå¼Ò |
RIST3µ¿ 3282È£
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Àåºñ¸í |
Àú¿ÂÀ¯ÁöÀåÄ¡(Cryostat System) |
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Oxford Instruments |
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CCC1104 |
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RIST3µ¿ 3289È£
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|
Àåºñ¸í |
GPC ½Ã½ºÅÛ(Gel Permeation Chromatography (GPC) System) |
Á¦ÀÛ»ç |
Waters |
¸ðµ¨¸í |
1525/2414/410 |
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RIST3µ¿ 3312È£
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|
Àåºñ¸í |
¹ÝµµÃ¼ Ư¼º ºÐ¼®±â(Semiconductor Characterization System) |
Á¦ÀÛ»ç |
KEITHLEY Instruments |
¸ðµ¨¸í |
4200 |
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RIST3µ¿ 3340È£
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|
Àåºñ¸í |
QE ÃøÁ¤±â(External and Internal Quantum Efficiency (EQE and IQE) Measurement System) |
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NEWPORT |
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Oriel IQE-200 |
¼³Ä¡Àå¼Ò |
RIST3µ¿ 3340È£
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|
Àåºñ¸í |
X-¼±±¤ÀüÀںб¤ºÐ¼®±â(XPS xonnectable Deposition system) |
Á¦ÀÛ»ç |
ULVAC-PHI, Inc. |
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PHI GENESIS Multi-tech Scanning XPS |
¼³Ä¡Àå¼Ò |
RIST3µ¿ 3360/3362È£
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|
Àåºñ¸í |
Áø°ø ¿ÁõÂø ½Ã½ºÅÛ(Vacuum Thermal Evaporating System) |
Á¦ÀÛ»ç |
WOOSUNG HI-VAC |
¸ðµ¨¸í |
- |
¼³Ä¡Àå¼Ò |
RIST3µ¿ 3363È£
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|
Àåºñ¸í |
½Ç½Ã°£ PCR ½Ã½ºÅÛ(Real-time Polymerase Chain Reaction (PCR) System) |
Á¦ÀÛ»ç |
Roche |
¸ðµ¨¸í |
LightCycler480 |
¼³Ä¡Àå¼Ò |
°¡Å縯´ë ÀÇ»ý¸í°øÇבּ¸¼Ò
|
|
Àåºñ¸í |
À̺ÒÈÁ¦³í ½Ä°¢±â(Xenon difluoride Etching system) |
Á¦ÀÛ»ç |
¢ß½ÎÀÌ¿£ÅØ |
¸ðµ¨¸í |
Xef2 etching system |
¼³Ä¡Àå¼Ò |
±â°è½ÇÇ赿 104È£
|
|
Àåºñ¸í |
Ãʰí¼Ó µðÁöÅÐ Ä«¸Þ¶ó ÀåÄ¡(High-speed Digital Camera System) |
Á¦ÀÛ»ç |
Photron Ltd. |
¸ðµ¨¸í |
FASTCAM Mini UX100 |
¼³Ä¡Àå¼Ò |
±â°è½ÇÇ赿 108È£
|
|
Àåºñ¸í |
´ÙÀÌ¿Àµå ·¹ÀÌÁ® ½Ã½ºÅÛ(Diode Laser System) |
Á¦ÀÛ»ç |
COHERENT |
¸ðµ¨¸í |
Chameleon Vision 2 |
¼³Ä¡Àå¼Ò |
±â°è½ÇÇ赿 206È£
|
|
Àåºñ¸í |
ÆèÅäÃÊ ÆÞ½º ·¹ÀÌÀú ½Ã½ºÅÛ(Femtosecond Pulse Laser System) |
Á¦ÀÛ»ç |
COHERENT |
¸ðµ¨¸í |
Chameleon |
¼³Ä¡Àå¼Ò |
±â°è½ÇÇ赿 206È£
|
|
Àåºñ¸í |
°í¼Ó ¿ø¼ÒºÐ¼®ÀÌ °¡´ÉÇÑ Àü°è ¹æÃâÇü ÁÖ»çÀüÀÚÇö¹Ì°æ(FE-SEM with high speed EDS system) |
Á¦ÀÛ»ç |
JEOL LTD. |
¸ðµ¨¸í |
JSM-7800F Prime |
¼³Ä¡Àå¼Ò |
³ª³ëÀ¶ÇÕ±â¼ú¿ø 101È£
|
|
Àåºñ¸í |
3D Ç¥¸éÃøÁ¤ ½Ã½ºÅÛ(3D Optical Surface Metrology System) |
Á¦ÀÛ»ç |
Leica Microsystems |
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DCM 3D |
¼³Ä¡Àå¼Ò |
³ª³ëÀ¶ÇÕ±â¼ú¿ø 216È£
|
|
Àåºñ¸í |
Áø°ø ¿ÁõÂø ½Ã½ºÅÛ(Thermal Evaporating System) |
Á¦ÀÛ»ç |
DDONG High Technologies |
¸ðµ¨¸í |
Thermal Evaporator System |
¼³Ä¡Àå¼Ò |
³ª³ëÀ¶ÇÕ±â¼ú¿ø 311È£
|
|
Àåºñ¸í |
°¡½º Èñ¼® ½Ã½ºÅÛ(Computerized Gas Dilution System) |
Á¦ÀÛ»ç |
Environics |
¸ðµ¨¸í |
Series 4040 |
¼³Ä¡Àå¼Ò |
³ª³ëÀ¶ÇÕ±â¼ú¿ø 311È£
|
|
Àåºñ¸í |
À̿¿¬¸¶±â(Ion Milling System) |
Á¦ÀÛ»ç |
GL CORPORATION |
¸ðµ¨¸í |
PIPS1 691 |
¼³Ä¡Àå¼Ò |
³ª³ëÀ¶ÇÕ±â¼ú¿ø ½ÃÆíÁغñ½Ç 312È£
|
|
Àåºñ¸í |
Àú¿¡³ÊÁö À̿ ¿¬¸¶±â(Gentle Mill (Low Energy Ion Milling System)) |
Á¦ÀÛ»ç |
TechnoOrg Linda |
¸ðµ¨¸í |
IV5 |
¼³Ä¡Àå¼Ò |
³ª³ëÀ¶ÇÕ±â¼ú¿ø ½ÃÆíÁغñ½Ç 312È£
|
|
Àåºñ¸í |
ÀüÀÚºö ÁõÂø±â(E-beam Evaporating System) |
Á¦ÀÛ»ç |
Korea Vacuum Tech |
¸ðµ¨¸í |
KVE-C300160 |
¼³Ä¡Àå¼Ò |
³ª³ëÀ¶ÇÕ±â¼ú¿ø Ŭ¸°·ëµ¿ 2Ãþ Ŭ¸°·ë
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|
Àåºñ¸í |
±Ý¼Ó À¯±â¹° ÈÇбâ»óÁõÂø ½Ã½ºÅÛ(Metalorganic Chemical Vapor Deposition (MOVCD) System) |
Á¦ÀÛ»ç |
Jusung Eng. |
¸ðµ¨¸í |
Eureka 2000 |
¼³Ä¡Àå¼Ò |
³ª³ëÀ¶ÇÕ±â¼ú¿ø Ŭ¸°·ëµ¿ 2Ãþ Ŭ¸°·ë
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|
Àåºñ¸í |
ÀüÀÚºö ÁõÂø±â(E-beam Evaporating System) |
Á¦ÀÛ»ç |
Korea Vacuum Tech |
¸ðµ¨¸í |
KVE-4000 |
¼³Ä¡Àå¼Ò |
³ª³ëÀ¶ÇÕ±â¼ú¿ø Ŭ¸°·ëµ¿ 2Ãþ Ŭ¸°·ë
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|
Àåºñ¸í |
·¹ÀÌÀú ¸®¼Ò±×·¡ÇÇ ½Ã½ºÅÛ(Laser Lithography system) |
Á¦ÀÛ»ç |
Heidelberg Instruments |
¸ðµ¨¸í |
DWL-200 |
¼³Ä¡Àå¼Ò |
³ª³ëÀ¶ÇÕ±â¼ú¿ø Ŭ¸°·ëµ¿ 2Ãþ Ŭ¸°·ë
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Àåºñ¸í |
½ºÆ®·¹½º ÃøÁ¤ ½Ã½ºÅÛ(Stress Measurement System) |
Á¦ÀÛ»ç |
FSM |
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500TC |
¼³Ä¡Àå¼Ò |
³ª³ëÀ¶ÇÕ±â¼ú¿ø Ŭ¸°·ëµ¿ 2Ãþ Ŭ¸°·ë
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|
Àåºñ¸í |
½ºÆÛÅ͸µ ½Ã½ºÅÛ(Sputtering System) |
Á¦ÀÛ»ç |
SNTEK |
¸ðµ¨¸í |
MSS5000 |
¼³Ä¡Àå¼Ò |
³ª³ëÀ¶ÇÕ±â¼ú¿ø Ŭ¸°·ëµ¿ 2Ãþ Ŭ¸°·ë
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|
Àåºñ¸í |
½ºÆÛÅ͸µ ½Ã½ºÅÛ(Sputtering System) |
Á¦ÀÛ»ç |
AMAT |
¸ðµ¨¸í |
E5500 |
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³ª³ëÀ¶ÇÕ±â¼ú¿ø Ŭ¸°·ëµ¿ 2Ãþ Ŭ¸°·ë
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|
Àåºñ¸í |
ÀüÀÚºö ÁõÂø±â(E-beam Evaporating System) |
Á¦ÀÛ»ç |
Korea Vacuum Tech |
¸ðµ¨¸í |
KVE-C300160 |
¼³Ä¡Àå¼Ò |
³ª³ëÀ¶ÇÕ±â¼ú¿ø Ŭ¸°·ëµ¿ 2Ãþ Ŭ¸°·ë
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|
Àåºñ¸í |
ÃʰíÇØ»óµµ smFRET STORM À̹Ì¡ Àåºñ(Super-resolution smFRET STORM imaging system) |
Á¦ÀÛ»ç |
ONI |
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Oxford Nanoimager S |
¼³Ä¡Àå¼Ò |
»ý¸í°øÇבּ¸¼¾ÅÍ 253È£
|
|
Àåºñ¸í |
·¹ÀÌÀú ¹Ì¼¼ ÇØºÎ ½Ã½ºÅÛ(Laser Microdissection Microscope System) |
Á¦ÀÛ»ç |
Carl Zeiss |
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PALM MicroBeam |
¼³Ä¡Àå¼Ò |
»ý¸í°øÇבּ¸¼¾ÅÍ 341È£
|
|
Àåºñ¸í |
Ź»óÇü ¸¶ÀÌÅ©·Î¾î·¹ÀÌ ½Ã½ºÅÛ(Benchtop Microarray System) |
Á¦ÀÛ»ç |
GENETIX |
¸ðµ¨¸í |
QArray mini |
¼³Ä¡Àå¼Ò |
»ý¸í°øÇבּ¸¼¾ÅÍ 458È£
|
|
Àåºñ¸í |
ÇÁ·£Ä« ¸®¼Ä¡ 3 ·Îº¿ ½Ã½ºÅÛ(FRANKA RESEARCH 3 robot system) |
Á¦ÀÛ»ç |
Franka Robotics |
¸ðµ¨¸í |
Franka Research 3 |
¼³Ä¡Àå¼Ò |
ÀΰøÁö´É¿¬±¸¿ø 142È£
|
|
Àåºñ¸í |
¸ð¼Çĸó ½Ã½ºÅÛ(Motion Capture System) |
Á¦ÀÛ»ç |
Optitrack |
¸ðµ¨¸í |
OptiTrack Motion Tracking System |
¼³Ä¡Àå¼Ò |
ÀΰøÁö´É¿¬±¸¿ø 142È£
|
|
Àåºñ¸í |
·¹ÀÌÀú ½Ã½ºÅÛ(Laser System) |
Á¦ÀÛ»ç |
KIMMON KOHA |
¸ðµ¨¸í |
IK3301R-G |
¼³Ä¡Àå¼Ò |
Á¦1°øÇаü 206È£
|
|
Àåºñ¸í |
½ºÅ©·¡Ä¡ ½ÃÇè±â(Scratch Tester) |
Á¦ÀÛ»ç |
R&B |
¸ðµ¨¸í |
RB 311 Sketch |
¼³Ä¡Àå¼Ò |
Á¦1°øÇаü 206È£
|
|
Àåºñ¸í |
¿¢½Ã¸Ó ·¹ÀÌÀú ½Ã½ºÅÛ(Excimer Laser System) |
Á¦ÀÛ»ç |
LAMBDA PHYSIK AG |
¸ðµ¨¸í |
Compex 205 |
¼³Ä¡Àå¼Ò |
Á¦1°øÇаü 208È£
|
|
Àåºñ¸í |
LED ÃøÁ¤ ½Ã½ºÅÛ(Wafer-level LED Measurement System) |
Á¦ÀÛ»ç |
WithLight |
¸ðµ¨¸í |
OPI-170 |
¼³Ä¡Àå¼Ò |
Á¦1°øÇаü 208È£
|
|
Àåºñ¸í |
¹ÝµµÃ¼ Ư¼º ºÐ¼®±â(Semiconductor Characterization System) |
Á¦ÀÛ»ç |
KEITHLEY Instruments |
¸ðµ¨¸í |
4200-SCS |
¼³Ä¡Àå¼Ò |
Á¦1°øÇаü 208È£
|
|
Àåºñ¸í |
Áø°ø ¿ÁõÂø ½Ã½ºÅÛ(Thermal Evaporating System) |
Á¦ÀÛ»ç |
GD-Tech |
¸ðµ¨¸í |
KVT-2008L |
¼³Ä¡Àå¼Ò |
Á¦1°øÇаü 210È£
|
|
Àåºñ¸í |
Ãʰí¼Ó µðÁöÅÐ Ä«¸Þ¶ó ÀåÄ¡(High-speed Digital Camera System) |
Á¦ÀÛ»ç |
(ÁÖ)¾ÅÅ©·Ð |
¸ðµ¨¸í |
MotionPro Y7S1 |
¼³Ä¡Àå¼Ò |
Á¦1½ÇÇ赿 314È£
|
|
Àåºñ¸í |
ÀÔÀÚ ¿µ»ó À¯¼Ó°è(Particle Image Velocimetry (PIV) System) |
Á¦ÀÛ»ç |
TSI |
¸ðµ¨¸í |
MODULE4G-2DPIV |
¼³Ä¡Àå¼Ò |
Á¦1½ÇÇ赿 316È£
|
|
Àåºñ¸í |
À̿ ũ·Î¸¶Åä±×·¡ÇÇ ½Ã½ºÅÛ(Ion Chromatography System) |
Á¦ÀÛ»ç |
Thermo Scientific |
¸ðµ¨¸í |
DIONEX ICS-2100 |
¼³Ä¡Àå¼Ò |
Á¦1½ÇÇ赿 318È£
|
|
Àåºñ¸í |
Àç»ý ÁõÆø±â(Regenerative Amplifier System) |
Á¦ÀÛ»ç |
Spectra-Physics |
¸ðµ¨¸í |
Spitfire Ace |
¼³Ä¡Àå¼Ò |
Á¦2°øÇаü 504È£
|
|
Àåºñ¸í |
Çö¹Ì°æ Stage ¹× Á¶Àý ½Ã½ºÅÛ(Microscope Stage and Controller System) |
Á¦ÀÛ»ç |
Applied Scientific Instrumentation (ASI) |
¸ðµ¨¸í |
MS-2000 |
¼³Ä¡Àå¼Ò |
Á¦3°øÇаü 006È£
|
|
Àåºñ¸í |
¿¢½Ã¸Ó ·¹ÀÌÀú ½Ã½ºÅÛ(Excimer Laser System) |
Á¦ÀÛ»ç |
COHERENT |
¸ðµ¨¸í |
COMPex Pro |
¼³Ä¡Àå¼Ò |
Á¦3°øÇаü 206È£
|
|
Àåºñ¸í |
ÆèÅäÃÊ ÆÞ½º ·¹ÀÌÀú ½Ã½ºÅÛ(Femtosecond Pulse Laser System) |
Á¦ÀÛ»ç |
COHERENT |
¸ðµ¨¸í |
Chameleon |
¼³Ä¡Àå¼Ò |
Á¦3°øÇаü 502AÈ£
|
|
Àåºñ¸í |
¿¢½Ã¸Ó ·¹ÀÌÀú ½Ã½ºÅÛ(Excimer Laser System) |
Á¦ÀÛ»ç |
COHERENT |
¸ðµ¨¸í |
COMPex Pro 199F |
¼³Ä¡Àå¼Ò |
Á¦3°øÇаü 508È£
|
|
Àåºñ¸í |
´Ù¸ñÀû ¹Ú¸· Ç¥¸é±¸Á¶ ºÐ¼® ¿øÀÚ Çö¹Ì°æ Àåºñ(Muti-purpose Atomic Force Microscope (AFM) System) |
Á¦ÀÛ»ç |
Bruker |
¸ðµ¨¸í |
MultiMode 8 |
¼³Ä¡Àå¼Ò |
Á¦3°øÇаü 529È£
|
|
Àåºñ¸í |
32ä³Î ³úÆÄ ÃøÁ¤ ½Ã½ºÅÛ(32-Channel Electroencephalogram (EEG) Measurement System) |
Á¦ÀÛ»ç |
LAXTHA |
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LXE3232-RF |
¼³Ä¡Àå¼Ò |
Á¦4°øÇаü 005È£
|
|
Àåºñ¸í |
¹«¼± ±ÙÀüµµ ½Ã½ºÅÛ(Electromyographic (EMG) and Sensor System) |
Á¦ÀÛ»ç |
NORAXON |
¸ðµ¨¸í |
TELEMYO 2400R G2 |
¼³Ä¡Àå¼Ò |
Á¦4°øÇаü 005È£
|
|
Àåºñ¸í |
ÀÎÀå ½ÃÇè±â(Flex Test Controller) |
Á¦ÀÛ»ç |
MTS |
¸ðµ¨¸í |
MTS Quotation for FlexTest 40 Controller |
¼³Ä¡Àå¼Ò |
Á¦5°øÇаü 004È£
|
|
Àåºñ¸í |
³ª³ë½Ã½º SPM Á¶Àý ½Ã½ºÅÛ(Nanonis Scanning Probe Microscopy (SPM) Control System) |
Á¦ÀÛ»ç |
SPECS |
¸ðµ¨¸í |
SPECS Nanonis Controller |
¼³Ä¡Àå¼Ò |
Á¦5°øÇаü 008È£
|
|
Àåºñ¸í |
Àç·á½ÃÇè±â(Nano Testing System) |
Á¦ÀÛ»ç |
MTS |
¸ðµ¨¸í |
Nano UTM Testing System |
¼³Ä¡Àå¼Ò |
Á¦5°øÇаü 206-1È£
|
|
Àåºñ¸í |
ÆØÃ¢°è¼ö ÃøÁ¤±â(Dilatometer System) |
Á¦ÀÛ»ç |
ERICH NETZSCH GmbH & Co. Holdi |
¸ðµ¨¸í |
DIL 402C Dilatometer |
¼³Ä¡Àå¼Ò |
Á¦5°øÇаü 206È£
|
|
Àåºñ¸í |
¸ð¼¼°üÇü°¡¿·Î(Capillary Furnace System) |
Á¦ÀÛ»ç |
Malvern Instruments |
¸ðµ¨¸í |
Rosand RH7 |
¼³Ä¡Àå¼Ò |
Á¦5°øÇаü 206È£
|
|
Àåºñ¸í |
»ó¿Â¿È®»êµµÃøÁ¤Àåºñ(Flash Diffusivity Testing Apparatus) |
Á¦ÀÛ»ç |
ERICH NETZSCH GmbH & Co. Holdi |
¸ðµ¨¸í |
LFA 467 |
¼³Ä¡Àå¼Ò |
Á¦5°øÇаü 304È£
|
|
Àåºñ¸í |
ÆèÅäÃÊ ·¹ÀÌÀú ½Ã½ºÅÛ(Femtosecond Laser System) |
Á¦ÀÛ»ç |
COHERENT |
¸ðµ¨¸í |
Libra |
¼³Ä¡Àå¼Ò |
Á¦5°øÇаü 406È£
|
|
Àåºñ¸í |
À̿ ũ·Î¸¶Åä±×·¡ÇÇ ½Ã½ºÅÛ(Ion Chromatography System) |
Á¦ÀÛ»ç |
(ÁÖ)¼¼´ÏÁ¨ |
¸ðµ¨¸í |
Dionex Aquion IC system |
¼³Ä¡Àå¼Ò |
Áö°î¿¬±¸µ¿ 228È£
|
|
Àåºñ¸í |
µ¿Àû ±â°èÀû¹°¼º ½ÃÇè±â(Dynamic Material Testing System) |
Á¦ÀÛ»ç |
Dynamic Systems |
¸ðµ¨¸í |
GLEEBLE 3500 |
¼³Ä¡Àå¼Ò |
ö°´ëÇпø 142-4È£
|
|
Àåºñ¸í |
¸ÖƼ ½ºÄÉÀÏ ¹Ì¼¼±¸Á¶ ºÐ¼® ½Ã½ºÅÛ(Multi-scale Microstructure Analysis System) |
Á¦ÀÛ»ç |
JEOL |
¸ðµ¨¸í |
Neo-ARM |
¼³Ä¡Àå¼Ò |
ö°´ëÇпø 161È£
|
|
Àåºñ¸í |
¿Áß·®/¿·® µ¿½Ã ºÐ¼®±â(Thermal Analyzer System) |
Á¦ÀÛ»ç |
netzsch geraetebau gmbh |
¸ðµ¨¸í |
STA 449C |
¼³Ä¡Àå¼Ò |
ö°´ëÇпø 178-9È£
|
|
Àåºñ¸í |
µ¿Àû ±â°èÀû¹°¼º ½ÃÇè±â(Dynamic Material Testing System) |
Á¦ÀÛ»ç |
Dynamic Systems |
¸ðµ¨¸í |
GLEEBLE 3500 |
¼³Ä¡Àå¼Ò |
ö°´ëÇпø 242-4È£
|
|
Àåºñ¸í |
ÆØÃ¢°è¼ö ÃøÁ¤±â(Dilatometer System) |
Á¦ÀÛ»ç |
bahr-thermoanalyse gmbh |
¸ðµ¨¸í |
DIL805A/D |
¼³Ä¡Àå¼Ò |
ö°´ëÇпø 242-4È£
|
|
Àåºñ¸í |
ºñƲ¸² ½ÃÇè±â(Tortion Tester) |
Á¦ÀÛ»ç |
ACE E&C,INC. |
¸ðµ¨¸í |
TRA-2K |
¼³Ä¡Àå¼Ò |
ö°´ëÇпø 242-4È£
|
|
Àåºñ¸í |
Ç¥¸é󸮽ýºÅÛ(Target Surfacing System) |
Á¦ÀÛ»ç |
Leica Microsystems |
¸ðµ¨¸í |
EM TXP |
¼³Ä¡Àå¼Ò |
ö°´ëÇпø 250È£
|
|
Àåºñ¸í |
°í¿ÂÀÎÀå½ÃÇè±â(High Temp Universel Testing Instrument) |
Á¦ÀÛ»ç |
INSTRON |
¸ðµ¨¸í |
M5582 |
¼³Ä¡Àå¼Ò |
ö°´ëÇпø 284È£
|
|
Àåºñ¸í |
TEM¿ë À̿¹иµ½Ã½ºÅÛ(Ion Milling System for Transmission Electron Microscope (TEM)) |
Á¦ÀÛ»ç |
¢ßÁö¿¤ÄÚÆÛ·¹ÀÌ¼Ç |
¸ðµ¨¸í |
Gatan model 691 |
¼³Ä¡Àå¼Ò |
ö°´ëÇпø 284È£
|
|
Àåºñ¸í |
Àç·á½ÃÇè±â(Advanced Indentation System) |
Á¦ÀÛ»ç |
(ÁÖ)ÇÁ·Ðƽ½º |
¸ðµ¨¸í |
AIS2000 |
¼³Ä¡Àå¼Ò |
ö°´ëÇпø 312-4È£
|
|
Àåºñ¸í |
¹ü¿ë ½ÃÇè±â(Universal Sheet Metal Testing Machine) |
Á¦ÀÛ»ç |
ERICHSEN |
¸ðµ¨¸í |
145-60 |
¼³Ä¡Àå¼Ò |
ö°´ëÇпø 331-3È£
|
|
Àåºñ¸í |
°í¼ÓÀÎÀåÃæ°Ý½ÃÇè±â(High Strain Tensile Impact Tester) |
Á¦ÀÛ»ç |
´ëµ¿Á¤¹Ð |
¸ðµ¨¸í |
Ư¼öÁ¦ÀÛ |
¼³Ä¡Àå¼Ò |
ö°´ëÇпø 331-3È£
|
|
Àåºñ¸í |
±ÝÇüÅ×½ºÅͱâ(U Draw Test Mold for Servo Press) |
Á¦ÀÛ»ç |
R&B |
¸ðµ¨¸í |
Ư¼öÁ¦ÀÛ |
¼³Ä¡Àå¼Ò |
ö°´ëÇпø 331-3È£
|
|
Àåºñ¸í |
ö¼ÕÃøÁ¤ÀåÄ¡(Electrical Steel Tester) |
Á¦ÀÛ»ç |
Dr. brockhaus messtechnik gmbh |
¸ðµ¨¸í |
MPG 100 D measuring Unit |
¼³Ä¡Àå¼Ò |
ö°´ëÇпø 374È£
|
|
Àåºñ¸í |
¿¿ªÇнùķ¹ÀÌÅÍ(Caster&Thermo-mechanical Simulator) |
Á¦ÀÛ»ç |
Fuji electronic Industrial |
¸ðµ¨¸í |
FTX-103HC-01 |
¼³Ä¡Àå¼Ò |
ö°´ëÇпø 374È£
|
|
Àåºñ¸í |
½ºÆÛÅÍ / Áø°øÁõÂø ÀåÄ¡(Sputtering / Vacuum Deposition System) |
Á¦ÀÛ»ç |
¾ÆÀ̾¾Æ¼ |
¸ðµ¨¸í |
Ư¼öÁ¦ÀÛ |
¼³Ä¡Àå¼Ò |
ö°´ëÇпø 374È£
|
|
Àåºñ¸í |
±Ý¼Ó Żź ¿Ã³¸® ½Ã½ºÅÛ(Tube Type Furnace System) |
Á¦ÀÛ»ç |
¢ßº£½º |
¸ðµ¨¸í |
Ư¼öÁ¦ÀÛ |
¼³Ä¡Àå¼Ò |
ö°´ëÇпø 380È£
|
|
Àåºñ¸í |
µ¿Àû ±â°èÀû¹°¼º ½ÃÇè±â(Dynamic Material Testing System) |
Á¦ÀÛ»ç |
INSTRON |
¸ðµ¨¸í |
INSTRON 8801 |
¼³Ä¡Àå¼Ò |
ö°´ëÇпø 416-8È£
|
|
Àåºñ¸í |
ÇǷνÃÇè±â(Fatigue Testing Machine) |
Á¦ÀÛ»ç |
INSTRON |
¸ðµ¨¸í |
INSTRON 8801 |
¼³Ä¡Àå¼Ò |
ö°´ëÇпø 416-8È£
|
|
Àåºñ¸í |
µ¿Àû ±â°èÀû¹°¼º ½ÃÇè±â(Dynamic Material Testing System) |
Á¦ÀÛ»ç |
INSTRON |
¸ðµ¨¸í |
INSTRON 8801 |
¼³Ä¡Àå¼Ò |
ö°´ëÇпø 416È£
|
|
Àåºñ¸í |
µ¿Àû ±â°èÀû¹°¼º ½ÃÇè±â(Dynamic Material Testing System) |
Á¦ÀÛ»ç |
INSTRON |
¸ðµ¨¸í |
INSTRON 8501 |
¼³Ä¡Àå¼Ò |
ö°´ëÇпø 431-3È£
|
|
Àåºñ¸í |
Àç·á½ÃÇè±â(Material Testing Machine) |
Á¦ÀÛ»ç |
INSTRON |
¸ðµ¨¸í |
INSTRON 8862 |
¼³Ä¡Àå¼Ò |
ö°´ëÇпø 431-3È£
|
|
Àåºñ¸í |
¹ü¿ë Àç·á ½ÃÇè±â(Universal Testing System) |
Á¦ÀÛ»ç |
INSTRON |
¸ðµ¨¸í |
INSTRON 3382 |
¼³Ä¡Àå¼Ò |
ö°´ëÇпø 431-3È£
|
|
Àåºñ¸í |
¼ö¼Ò·® ºÐ¼® ½Ã½ºÅÛ(Total Dissolved Solids (TDS) System for Hydrogen Analysis) |
Á¦ÀÛ»ç |
R-Dec |
¸ðµ¨¸í |
HTDS-003 |
¼³Ä¡Àå¼Ò |
ö°´ëÇпø 435-7È£
|
|
Àåºñ¸í |
¼ö¿ÇÕ¼ºÀåºñ(500 mL Stirred Autoclave System) |
Á¦ÀÛ»ç |
¢ßÀϽſÀÅäŬ·¹À̺ê |
¸ðµ¨¸í |
Ư¼öÁ¦ÀÛ |
¼³Ä¡Àå¼Ò |
ö°´ëÇпø 472È£
|
|
Àåºñ¸í |
SOFC ´ÜÀüÁö Àå±â¼º´É Æò°¡ÀåÄ¡(Solid Oxide Fuel Cell (SOFC) Test Station) |
Á¦ÀÛ»ç |
³ª¶ó¼¿ÅØ(ÁÖ) |
¸ðµ¨¸í |
Ư¼öÁ¦ÀÛ |
¼³Ä¡Àå¼Ò |
ö°´ëÇпø 480È£
|
|
Àåºñ¸í |
½½·¡±×¿ëÇØ ¹× ³Ã°¢ÀåÄ¡(Slag Dissolution and Cooling System) |
Á¦ÀÛ»ç |
¸°Å×Å© |
¸ðµ¨¸í |
Ư¼öÁ¦ÀÛ |
¼³Ä¡Àå¼Ò |
ö°´ëÇпø 480È£
|
|
Àåºñ¸í |
°í¿Â°¡¿·Î(Image Furnace System) |
Á¦ÀÛ»ç |
ULVAC |
¸ðµ¨¸í |
MR-39H/D |
¼³Ä¡Àå¼Ò |
ö°´ëÇпø 546È£
|
|
Àåºñ¸í |
¾ÐÃà ¹× ÀÎÀå½ÃÇè±â(Tensile Compress Test Machine) |
Á¦ÀÛ»ç |
INSTRON |
¸ðµ¨¸í |
INSTRON 5848 |
¼³Ä¡Àå¼Ò |
ö°´ëÇпø 546È£
|
|
Àåºñ¸í |
µµ°¡´Ï ºÎÇÏ ½Ã½ºÅÛ(1600 ¡ÆC Furnace Crucible Leading System) |
Á¦ÀÛ»ç |
Lenton |
¸ðµ¨¸í |
LTF-16/75/610 |
¼³Ä¡Àå¼Ò |
ö°´ëÇпø 546È£
|
|
Àåºñ¸í |
À̹ÌÁö½Ã½ºÅÛ(Imaging System) |
Á¦ÀÛ»ç |
Dantec Dynamics A/S |
¸ðµ¨¸í |
Advanced Imaging System |
¼³Ä¡Àå¼Ò |
ö°´ëÇпø 572È£
|
|
Àåºñ¸í |
¿ëÇØ¿ë À¯µµ°¡¿ ÀåÄ¡(Induction Heating System for Melting) |
Á¦ÀÛ»ç |
PSTEK |
¸ðµ¨¸í |
Ư¼öÁ¦ÀÛ |
¼³Ä¡Àå¼Ò |
ö°´ëÇпø 584È£
|
|
Àåºñ¸í |
Å©¸®ÇÁ ½ÃÇè±â(Lever Arm Type Creep Tester System) |
Á¦ÀÛ»ç |
ats technology, Inc |
¸ðµ¨¸í |
Series 2320 Lever Arm Tester |
¼³Ä¡Àå¼Ò |
ö°´ëÇпø B106È£
|
|
Àåºñ¸í |
Àç·á½ÃÇè±â(Universal Materials Testing Machine) |
Á¦ÀÛ»ç |
zwick gmbh & co. kg |
¸ðµ¨¸í |
ZWICK 100KN |
¼³Ä¡Àå¼Ò |
ö°´ëÇпø ´ëÇü½ÇÇ赿
|
|
Àåºñ¸í |
Ãæ°Ý½ÃÇè±â(Charpy Impact Tester) |
Á¦ÀÛ»ç |
zwick gmbh & co. kg |
¸ðµ¨¸í |
PSW 750 |
¼³Ä¡Àå¼Ò |
ö°´ëÇпø ´ëÇü½ÇÇ赿
|
|
Àåºñ¸í |
ÇǷνÃÇè±â(Fatigue Testing Machine) |
Á¦ÀÛ»ç |
INSTRON |
¸ðµ¨¸í |
MicroTester5848 |
¼³Ä¡Àå¼Ò |
ö°´ëÇпø ´ëÇü½ÇÇ赿
|
|
Àåºñ¸í |
¾ÐÃà ¹× ÀÎÀå½ÃÇè±â(Tensile Compress Test Machine) |
Á¦ÀÛ»ç |
INSTRON |
¸ðµ¨¸í |
INSTRON 4482 |
¼³Ä¡Àå¼Ò |
ö°´ëÇпø ´ëÇü½ÇÇ赿
|
|
Àåºñ¸í |
¹úÁö/FLC ½ÃÇè±â(Bulge/Forming Limit Curves (FLC) Tester) |
Á¦ÀÛ»ç |
ERICHSEN |
¸ðµ¨¸í |
Model 161 |
¼³Ä¡Àå¼Ò |
ö°´ëÇпø ´ëÇü½ÇÇ赿
|
|
Àåºñ¸í |
ÀÌÃàÀÎÀå ½ÃÇè±â(Biaxial Tensile Testing machine) |
Á¦ÀÛ»ç |
Kokusai Co. Ltd |
¸ðµ¨¸í |
KBAT-100 |
¼³Ä¡Àå¼Ò |
ö°´ëÇпø ´ëÇü½ÇÇ赿
|
|
Àåºñ¸í |
½Ç½Ã°£ X-¼± °Ë»ç±â(Realtime X-ray Inspection System) |
Á¦ÀÛ»ç |
¢ßÀÚºñ½º |
¸ðµ¨¸í |
X-Scan 7950 |
¼³Ä¡Àå¼Ò |
ö°´ëÇпø ´ëÇü½ÇÇ赿
|
|
Àåºñ¸í |
¸¶ÂûƯ¼º Æò°¡ÀåÄ¡(Friction Tester) |
Á¦ÀÛ»ç |
(À¯)Á¾·Î°úÇлó»ç |
¸ðµ¨¸í |
CR-FR-CH1 |
¼³Ä¡Àå¼Ò |
ö°´ëÇпø ´ëÇü½ÇÇ赿
|
|
Àåºñ¸í |
½ºÆÛÅ͸µ ½Ã½ºÅÛ(Sputtering System) |
Á¦ÀÛ»ç |
¾ÆÆå½º(ÁÖ) |
¸ðµ¨¸í |
EOS-310(Á¦ÀÛǰ) |
¼³Ä¡Àå¼Ò |
Æ÷Ç×°¡¼Ó±â¿¬±¸¼Ò ÀúÀ帵µ¿ 118È£
|
|
Àåºñ¸í |
RIE ½Ã½ºÅÛ(Reactive Ion Etching (RIE) System) |
Á¦ÀÛ»ç |
(ÁÖ)¿ïÅØ |
¸ðµ¨¸í |
URS-100 |
¼³Ä¡Àå¼Ò |
Æ÷Ç×°¡¼Ó±â¿¬±¸¼Ò ÀúÀ帵µ¿ 118È£
|
|
Àåºñ¸í |
Á¡Åº¼ºÃøÁ¤±â(Rheometer system) |
Á¦ÀÛ»ç |
Ta Instruments |
¸ðµ¨¸í |
DHR-20 |
¼³Ä¡Àå¼Ò |
Æ÷Ç×½ÃÁö½Ä»ê¾÷¼¾ÅÍ wet-lab
|
|
Àåºñ¸í |
X-ray ÃøÁ¤½Ã½ºÅÛ(X-ray Measurement System) |
Á¦ÀÛ»ç |
¸ðµÎÅ×Å©³î·¯Áö, ¿ìÁ¤ÀÇ·á±â±â |
¸ðµ¨¸í |
Varian A272 |
¼³Ä¡Àå¼Ò |
dzµ¿µ¿ 108È£
|
|
Àåºñ¸í |
Àü±âÈÇÐ ºÐ¼®±â(Electrochemical Analyzer System) |
Á¦ÀÛ»ç |
Advanced Measurement Technology |
¸ðµ¨¸í |
2101A |
¼³Ä¡Àå¼Ò |
Çѱ¹·Îº¿À¶ÇÕ¿¬±¸¿ø 313È£
|
|
Àåºñ¸í |
GC/MSD ½Ã½ºÅÛ(Gas Chromatography/Mass Selective Detector (GC/MSD) System) |
Á¦ÀÛ»ç |
Agilent Technologies |
¸ðµ¨¸í |
-/5975C |
¼³Ä¡Àå¼Ò |
ȯ°æ°øÇе¿ 103/104È£
|
|
Àåºñ¸í |
°í¾Ð¿ë ºÎÇÇ½Ä ÈíÂøÀåºñ ¼ö¼Ò¿¡³ÊÁö ÀúÀå·® ÃøÁ¤ ÀÚµ¿È Àåºñ(Volumetric Sorption Measurement System) |
Á¦ÀÛ»ç |
Setaram |
¸ðµ¨¸í |
PCT Pro |
¼³Ä¡Àå¼Ò |
ȯ°æ°øÇе¿ 110È£
|
|
Àåºñ¸í |
GC/MSD ½Ã½ºÅÛ(Gas Chromatography/Mass Selective Detector (GC/MSD) System) |
Á¦ÀÛ»ç |
Agilent Technologies |
¸ðµ¨¸í |
7890B/- |
¼³Ä¡Àå¼Ò |
ȯ°æ°øÇе¿ 207È£
|
|
Àåºñ¸í |
À̿ ũ·Î¸¶Åä±×·¡ÇÇ ½Ã½ºÅÛ(Ion Chromatography System) |
Á¦ÀÛ»ç |
Metrohm |
¸ðµ¨¸í |
790 Personal IC |
¼³Ä¡Àå¼Ò |
ȯ°æ°øÇе¿ 230È£
|
|
Àåºñ¸í |
À̿ ũ·Î¸¶Åä±×·¡ÇÇ ½Ã½ºÅÛ(Ion Chromatography System) |
Á¦ÀÛ»ç |
Dionex |
¸ðµ¨¸í |
ICS-2100 |
¼³Ä¡Àå¼Ò |
ȯ°æ°øÇе¿ 302È£
|
|
Àåºñ¸í |
±¤ ¿¡³ÊÁö Àüȯ·ü ÃøÁ¤±â(Incident Photon-to-electron Conversion Efficiency (IPCE) System) |
Á¦ÀÛ»ç |
NEWPORT |
¸ðµ¨¸í |
Newport 74125 |
¼³Ä¡Àå¼Ò |
ȯ°æ°øÇе¿ 302È£
|
|
Àåºñ¸í |
·¹¿À¹ÌÅÍ(Rheometer System) |
Á¦ÀÛ»ç |
TA Instruments |
¸ðµ¨¸í |
DHR-1 |
¼³Ä¡Àå¼Ò |
ȯ°æ°øÇе¿ 303È£
|
|
Àåºñ¸í |
LC/MS/MS ½Ã½ºÅÛ(LC/MS/MS System) |
Á¦ÀÛ»ç |
Waters |
¸ðµ¨¸í |
Acquity HPLC System/TQ Detector |
¼³Ä¡Àå¼Ò |
ȯ°æ°øÇе¿ 317
|
|
Àåºñ¸í |
TFF ½Ã½ºÅÛ(Tangential Flow Filtration (TFF) System) |
Á¦ÀÛ»ç |
MERCK |
¸ðµ¨¸í |
Cogent M1 TFF System |
¼³Ä¡Àå¼Ò |
ȯ°æ°øÇе¿ 331È£
|
|
Àåºñ¸í |
ijÇÊ·¯¸® À̿ ũ·Î¸¶Åä±×·¡ÇÇ(Capillary Ion Chromatography System) |
Á¦ÀÛ»ç |
Thermo Scientific |
¸ðµ¨¸í |
Dionex ICS-5000 |
¼³Ä¡Àå¼Ò |
ȯ°æ°øÇе¿ 331È£
|
|
Àåºñ¸í |
Àڿܼ± ÆòÇ౤ Á¶»ç ½Ã½ºÅÛ(Mask Aligner and Exposure System) |
Á¦ÀÛ»ç |
PROWIN |
¸ðµ¨¸í |
M150P |
¼³Ä¡Àå¼Ò |
ȯ°æ°øÇе¿ 410È£
|
|
Àåºñ¸í |
ÀÓÇÇ´ø½º ÃøÁ¤Àåºñ(Impedance Analyzer System) |
Á¦ÀÛ»ç |
BioLogic |
¸ðµ¨¸í |
VSP-300 |
¼³Ä¡Àå¼Ò |
ȯ°æ°øÇе¿ 412È£
|
|
Àåºñ¸í |
ÀÓÇÇ´ø½º ÃøÁ¤Àåºñ(Impedance Analyzer System) |
Á¦ÀÛ»ç |
BioLogic |
¸ðµ¨¸í |
VSP-300 |
¼³Ä¡Àå¼Ò |
ȯ°æ°øÇе¿ 412È£
|
|
Àåºñ¸í |
GC/MSD ½Ã½ºÅÛ(Gas Chromatography/Mass Selective Detector (GC/MSD) System) |
Á¦ÀÛ»ç |
Agilent Techonologies |
¸ðµ¨¸í |
7890B/5977B |
¼³Ä¡Àå¼Ò |
ȯ°æ°øÇе¿ 412È£
|
|
Àåºñ¸í |
ÇÙ»ê ÃßÃâ±â(Auto Nucleic Acid Preparation System) |
Á¦ÀÛ»ç |
Precision System Science |
¸ðµ¨¸í |
Magtration System 12GC |
¼³Ä¡Àå¼Ò |
ȯ°æ°øÇе¿ 414È£
|
|
Àåºñ¸í |
À̿ ũ·Î¸¶Åä±×·¡ÇÇ ½Ã½ºÅÛ(Ion Chromatography System) |
Á¦ÀÛ»ç |
Dionex |
¸ðµ¨¸í |
ICS-1100 |
¼³Ä¡Àå¼Ò |
ȯ°æ°øÇе¿ 417È£
|