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Equipment Information
¿øÀÚÃþ ÁõÂø±â(Atomic Layer Deposition (ALD))
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Equip. Info.
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10037169
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Atomic Layer Deposition (ALD)
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QUROS
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Plus 200
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Standard process : Al2O3, HfO2, TiN
Process Temperature : 100 ~ 300¡É
Precusor : TMA, TEMAHf, TEMATi (UPChem)
Wafer size : up to 8inch wafer
Gases : Ar, O2, NH3, N2, H2
Ȱ¿ëºÐ¾ß
Al2O3 : high-k material for different semiconductor devices growing thin, conformal, pinhole-free films with featureless microstructure and low stress(in OLED) effective field-effect passivatio(in solar)
HfO2 : the dielectric constant of HfO2 is 4-6 times higher than that of SiO2
TiN : high thermodynamic stability, high corrosion resistance, low friction constant, low electrical resitivity, and high mechanical conductor
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¿øÀÚ°£·Â Çö¹Ì°æ(Atomic Force Microscope (AFM))
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Park Systems
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XE7
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C5 228È£
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ÆÐ·²¸° ÁõÂø±â(Parylene Deposition System)
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¿À¹æÅ×Å©³î·ÎÁö
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OBT-PC300
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C5 329È£
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ÆÞ½º ·¹ÀÌÀú ÁõÂø ½Ã½ºÅÛ(Pulsed Laser Deposition (PLD) System)
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ÇѺû·¹ÀÌÀú
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GPPA-A377
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C5 329È£
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¿ø·á ÁõÂø ½Ã½ºÅÛ(Materials Deposition System with Piezoelectric Inkjet Catridge)
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FUJIFILM
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Dimatix DMP-2850
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C5 329È£
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ÆÐ·²¸° ÁõÂø±â(Parylene Deposition System)
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Specialty Coating Systems (SCS) - A KISCO Company
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PDS Labcoter 2 (PDS 2010 LABCOTER)
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C5 720-1È£
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¿øÀÚ°£·Â Çö¹Ì°æ(Atomic Force Microscope (AFM))
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Park Systems
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XE7
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RIST1µ¿ 1139È£
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¿øÀÚÃþ ÁõÂø±â(Atomic Layer Deposition (ALD))
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CN1
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Atomic-Basic
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RIST1µ¿ 1139È£
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¿øÀÚ°£·Â Çö¹Ì°æ(Atomic Force Microscope (AFM))
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Bruker
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Dimension Icon with ScanAsyst
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RIST1µ¿ 1152È£
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¿øÀÚ Èí¼ö ºÐ±¤±â(Atomic Absorption Spectrometer (AAS))
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Analytik Jena
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contrAA 800
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RIST1µ¿ 1309È£
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¿­ È­ÇÐ ±â»ó ÁõÂø ÀåÄ¡(Thermal Chemical Vapor Deposition (CVD) System)
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SNTEK
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TCS5000
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RIST3µ¿ 3104È£
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ÇöóÁ ¿øÀÚÃþ ÁõÂø ½Ã½ºÅÛ(Plasma Enhanced Atomic Layer Deposition (PE-ALD) System)
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ForALL
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OZONE
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RIST3µ¿ 3223È£
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ÆÞ½º ·¹ÀÌÀú ÁõÂø ½Ã½ºÅÛ(Pulsed Laser Deposition (PLD) System)
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HIGGSLAB
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PLD SYSTEM
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RIST3µ¿ 3263È£
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ÆÞ½º ·¹ÀÌÀú ÁõÂø ½Ã½ºÅÛ(Pulsed Laser Deposition (PLD) System)
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COHERENT
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COMPex Pro 102 F
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RIST3µ¿ 3282È£
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X-¼±±¤ÀüÀںб¤ºÐ¼®±â(XPS xonnectable Deposition system)
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ULVAC-PHI, Inc.
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PHI GENESIS Multi-tech Scanning XPS
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RIST3µ¿ 3360/3362È£
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¿øÀÚ°£·Â Çö¹Ì°æ(Atomic Force Microscope (AFM))
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Veeco
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Dimension 3100
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³ª³ëÀ¶ÇÕ±â¼ú¿ø 1Ãþ 101È£
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À¯±â¹° ÁõÂø±â(Organic Molecular Beam Deposition (OMBD) & Thermal Evaporator)
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alpha-plus
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OMBD & Thermal
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±Ý¼Ó À¯±â¹° È­Çбâ»óÁõÂø ½Ã½ºÅÛ(Metalorganic Chemical Vapor Deposition (MOVCD) System)
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Jusung Eng.
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Eureka 2000
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Àú¾Ð È­ÇÐÁõÂøÀåÄ¡(ÆÛ´Ï½º ŸÀÔ)(Low Pressure Chemical Vapor Deposition (LP-CVD; Furnace Type))
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(ÁÖ)À¯ÁøÅ×Å©
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BJM100
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ÇöóÁ È­ÇÐ ±â»ó ÁõÂø±â(Plasma Enhanced Chemical Vapor Deposition (PE-CVD))
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¾ÆÅؽýºÅÛ
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UF-CVD 200
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»ó¾Ð È­Çбâ»óÁõÂø¹ý(Atmosphere Pressure Chemical Vapor Deposition (APCVD))
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Watkins Johnson
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WJ-1000T
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ź¼Ò³ª³ëÆ©ºê ÇÕ¼º CVD(Carbon Nanotube (CNT) Synthesis Chemical Vapor Deposition (CVD))
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ÇöóÁ È­ÇÐ ±â»ó ÁõÂø±â(Plasma Enhanced Chemical Vapor Deposition (PE-CVD))
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BMR Technology Co.
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HiDep-SC
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º¸È£¸·¿ë ÇöóÁ È­ÇÐ ±â»ó ÁõÂø±â(Plasma Enhanced Chemical Vapor Deposition (PE-CVD) for Passivation)
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TES
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TELIA200
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ÇöóÁ È­ÇÐ ±â»ó ÁõÂø±â(Plasma Enhanced Chemical Vapor Deposition (PE-CVD))
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Korea Vacuum Tech
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KVPED-T0583
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Á¦1°øÇаü 210È£
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´Ù¸ñÀû ¹Ú¸· Ç¥¸é±¸Á¶ ºÐ¼® ¿øÀÚ Çö¹Ì°æ Àåºñ(Muti-purpose Atomic Force Microscope (AFM) System)
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Bruker
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MultiMode 8
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Á¦3°øÇаü 529È£
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¿øÀÚ°£·Â Çö¹Ì°æ(Atomic Force Microscope (AFM))
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SEIKO INSTRUMENTS INC.
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SPI3800N Pro
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Á¦5°øÇаü 206-1È£
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½ºÆÛÅÍ / Áø°øÁõÂø ÀåÄ¡(Sputtering / Vacuum Deposition System)
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ö°­´ëÇпø 374È£
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2006-12-29
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URL
http://www.quros.co.kr
Ű¿öµå
ALD, Al2O3, Atomic, HfO2, TiN, SiO2, High-K, TMA, TEMAHf, TEMATi
XS
SM
MD
LG
77 Cheongam-ro, Nam-gu, Pohang, Gyeongbuk, Republic of Korea (37673)
+82-54-279-3653
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[Àӽà °³¹ß¿µ¿ª º¸±â] 216.73.217.130