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Plasma Enhanced Chemical Vapor Deposition (PE-CVD) for Passivation |
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TES |
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TELIA200 |
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Standard process : SiO2, SiN
Process Temperature : 250 ~ 400¡É
Base Presuure : under 5mTorr
Wafer size : up to 8inch wafer
Gases : SiH4, N2O, O2, NH3, N2, NF3, Ar |
Ȱ¿ëºÐ¾ß |
SiO2 :high depositon rate at relatively low temperatures excellent breakdown characteristics.
hard mask, insulator, final passivation
SiN : high dielectric constant(as compared to that of silicn dioxide) imperviousness to water vapor and ion diffusion radiation shielding
etch stop materials, spacers for the suicide materials, dielectric layer |
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À¯¼¼Æ÷ ºÐ¼®±â(High-end performance Flow Cytometer) |
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BD Biosciences |
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LSR Foretessa 4Laser |
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ÃÊ°í¼º´É ÀÚµ¿ ¼¼Æ÷ºÐ¼®±â(Ultra High-End Performance Flow Cytometry System) |
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Beckman Coulter |
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Perkin Elmer |
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10xGENOMICS |
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Visium CytAssist |
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BOIC [3311È£]
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C5 228È£
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Áø°ø ¿ÁõÂø ½Ã½ºÅÛ(Thermal Evaporating System) |
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GPPA-A377 |
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¿ø·á ÁõÂø ½Ã½ºÅÛ(Materials Deposition System with Piezoelectric Inkjet Catridge) |
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Dimatix DMP-2850 |
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C5 329È£
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ÇöóÁ ó¸® ½Ã½ºÅÛ(Plasma Treatment Machine) |
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Nordson |
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AP-300 Plasma System |
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C5 720-1È£
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ÆÐ·²¸° ÁõÂø±â(Parylene Deposition System) |
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Specialty Coating Systems (SCS) - A KISCO Company |
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PDS Labcoter 2 (PDS 2010 LABCOTER) |
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C5 720-1È£
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ÀüÀÚºö ÁõÂø±â(E-beam Evaporating System) |
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TEMESCAL/BOC COATING TECH |
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BDJ 1800 |
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Park Systems |
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XE7 |
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¿øÀÚÃþ ÁõÂø±â(Atomic Layer Deposition (ALD)) |
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CN1 |
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Atomic-Basic |
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ÀüÀÚºö ÁõÂø±â(E-beam Evaporating System) |
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Telemark |
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246-28 |
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Bruker |
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°íºÐÇØ´É À¯µµ °áÇÕ ÇöóÁ Áú·®ºÐ¼®±â(High Resolution Inductively Coupled Plasma Mass Spectrometer (HR-ICP-MS)) |
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Thermo Scientific |
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ELEMENT XR |
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Àû¿Ü¼± ºÐ±¤±â(Fourier-transform Infrared (FT-IR) Spectrometer) |
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Bruker |
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VERTEX 70 |
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»ïÁß »ç±ØÀÚ À¯µµ °áÇÕ ÇöóÁ Áú·®ºÐ¼®±â(Triple Quadrupole Inductively Coupled Plasma Mass Spectrometer (TQ-ICP-MS)) |
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Thermo Scientific |
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iCAP TQ |
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AMETEK |
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Spectro Arcos |
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PerkinElmer |
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Optima 8300 |
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Thermo Scientific |
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iCAP 7000 Series |
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AMETEK |
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Spectro Arcos |
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°í¼º´É ¾×ü Å©·Î¸¶Åä±×·¡ÇÇ(Ultra High Performance Liquid Chromatograph (UHPLC)) |
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Thermo Scientific |
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DIONEX UltiMate 3000 |
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°í¼º´É ¾×ü Å©·Î¸¶Åä±×·¡ÇÇ(Ultra High Performance Liquid Chromatograph (UHPLC)) |
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Thermo Scientific |
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DIONEX UltiMate 3000 |
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Selcos |
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Cetus-E |
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¿ ÈÇÐ ±â»ó ÁõÂø ÀåÄ¡(Thermal Chemical Vapor Deposition (CVD) System) |
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TCS5000 |
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Áø°ø ¿ÁõÂø ½Ã½ºÅÛ(Thermal Evaporating System) |
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TERALEADER |
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TLP1001 |
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ÀüÀÚºö ÁõÂø±â(E-beam Evaporating System) |
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3D º¯ÇüÃøÁ¤½Ã½ºÅÛ(3D Deformation Analysis System) |
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GOM international AG |
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ARAMIS 12M |
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ÇöóÁ ¿øÀÚÃþ ÁõÂø ½Ã½ºÅÛ(Plasma Enhanced Atomic Layer Deposition (PE-ALD) System) |
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ForALL |
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OZONE |
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RIST3µ¿ 3223È£
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ÆÞ½º ·¹ÀÌÀú ÁõÂø ½Ã½ºÅÛ(Pulsed Laser Deposition (PLD) System) |
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HIGGSLAB |
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PLD SYSTEM |
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ÆÞ½º ·¹ÀÌÀú ÁõÂø ½Ã½ºÅÛ(Pulsed Laser Deposition (PLD) System) |
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COHERENT |
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COMPex Pro 102 F |
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X-¼±±¤ÀüÀںб¤ºÐ¼®±â(XPS xonnectable Deposition system) |
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ULVAC-PHI, Inc. |
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PHI GENESIS Multi-tech Scanning XPS |
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RIST3µ¿ 3360/3362È£
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Áø°ø ¿ÁõÂø ½Ã½ºÅÛ(Vacuum Thermal Evaporating System) |
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WOOSUNG HI-VAC |
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RIST3µ¿ 3363È£
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°í¼º´É À¯¼¼Æ÷ºÐ¼®±â(High Performance Flow Cytometer) |
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Becton Dickinson And Company |
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FACS Canto II |
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¿øÀÚ°£·Â Çö¹Ì°æ(Atomic Force Microscope (AFM)) |
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Veeco |
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Dimension 3100 |
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Áø°ø ¿ÁõÂø ½Ã½ºÅÛ(Thermal Evaporating System) |
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DDONG High Technologies |
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Thermal Evaporator System |
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ÀüÀÚºö ÁõÂø±â(E-beam Evaporating System) |
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Korea Vacuum Tech |
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KVE-C300160 |
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À¯±â¹° ÁõÂø±â(Organic Molecular Beam Deposition (OMBD) & Thermal Evaporator) |
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alpha-plus |
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OMBD & Thermal |
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±Ý¼Ó À¯±â¹° ÈÇбâ»óÁõÂø ½Ã½ºÅÛ(Metalorganic Chemical Vapor Deposition (MOVCD) System) |
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Jusung Eng. |
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Eureka 2000 |
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¿øÀÚÃþ ÁõÂø±â(Atomic Layer Deposition (ALD)) |
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QUROS |
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Plus 200 |
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ÀüÀÚºö ÁõÂø±â(E-beam Evaporating System) |
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Korea Vacuum Tech |
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KVE-4000 |
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Àú¾Ð ÈÇÐÁõÂøÀåÄ¡(ÆÛ´Ï½º ŸÀÔ)(Low Pressure Chemical Vapor Deposition (LP-CVD; Furnace Type)) |
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(ÁÖ)À¯ÁøÅ×Å© |
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BJM100 |
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ÇöóÁ ÈÇÐ ±â»ó ÁõÂø±â(Plasma Enhanced Chemical Vapor Deposition (PE-CVD)) |
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¾ÆÅؽýºÅÛ |
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UF-CVD 200 |
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(ÁÖ)µð¿¥¿¡½º |
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ICP Etcher |
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»ó¾Ð ÈÇбâ»óÁõÂø¹ý(Atmosphere Pressure Chemical Vapor Deposition (APCVD)) |
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Watkins Johnson |
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WJ-1000T |
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ź¼Ò³ª³ëÆ©ºê ÇÕ¼º CVD(Carbon Nanotube (CNT) Synthesis Chemical Vapor Deposition (CVD)) |
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¾ÆÅؽýºÅÛ |
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ÇöóÁ ÈÇÐ ±â»ó ÁõÂø±â(Plasma Enhanced Chemical Vapor Deposition (PE-CVD)) |
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BMR Technology Co. |
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HiDep-SC |
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ÀüÀÚºö ÁõÂø±â(E-beam Evaporating System) |
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Korea Vacuum Tech |
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KVE-C300160 |
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µå¶ø¼¼ÅÍ(Drop Setter for Protein Crystallization) |
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FORMULATRIX |
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NT8 |
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»ý¸í°úÇаü 204È£
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Àåºñ¸í |
ÇöóÁ ÈÇÐ ±â»ó ÁõÂø±â(Plasma Enhanced Chemical Vapor Deposition (PE-CVD)) |
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Korea Vacuum Tech |
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KVPED-T0583 |
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Á¦1°øÇаü 210È£
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Àåºñ¸í |
°Ç½Ä½Ä°¢ÀåÄ¡(Inductively Coupled Plasma (ICP) Etcher) |
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Korea Vacuum Tech |
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KVICP-T406530 |
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Á¦1°øÇаü 210È£
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Àåºñ¸í |
Áø°ø ¿ÁõÂø ½Ã½ºÅÛ(Thermal Evaporating System) |
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GD-Tech |
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KVT-2008L |
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Á¦1°øÇаü 210È£
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Àåºñ¸í |
À¯µµ °áÇÕ ÇöóÁ Áú·®ºÐ¼®±â(Inductively Coupled Plasma Mass Spectrometer (ICP-MS)) |
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PerkinElmer |
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NexION-300D |
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Á¦1½ÇÇ赿 318È£
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´ÙÀÌ¿Àµå ·¹ÀÌÀú Á¶Àý±â(Digital Controller for Diode Lasers) |
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Toptica Photonics |
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DLC pro |
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Á¦3°øÇаü 402È£
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´Ù¸ñÀû ¹Ú¸· Ç¥¸é±¸Á¶ ºÐ¼® ¿øÀÚ Çö¹Ì°æ Àåºñ(Muti-purpose Atomic Force Microscope (AFM) System) |
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Bruker |
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MultiMode 8 |
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Á¦3°øÇаü 529È£
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Àåºñ¸í |
¿øÀÚ°£·Â Çö¹Ì°æ(Atomic Force Microscope (AFM)) |
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SEIKO INSTRUMENTS INC. |
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SPI3800N Pro |
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Á¦5°øÇаü 206-1È£
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Àåºñ¸í |
Ç¥¸éÈûÃøÁ¤±â(Surface Force Apparatus (SFA)) |
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SurForce LLC |
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SFA 2000 |
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Áö°î¿¬±¸µ¿ 230È£
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Àåºñ¸í |
Ç¥¸éÈûÃøÁ¤±â(Surface Force Apparatus (SFA)) |
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SurForce LLC |
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SFA 2000 |
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Áö°î¿¬±¸µ¿ 230È£
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Àåºñ¸í |
À¯µµ °áÇÕ ÇöóÁ ºÐ±¤ºÐ¼®±â(Inductively Coupled Plasma-Optical Emission Spectrometry (ICP-OES)) |
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Thermo Scientific |
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iCAP 6500 DUO |
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ö°´ëÇпø 176È£
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TEM¿ë À̿¹иµ½Ã½ºÅÛ(Ion Milling System for Transmission Electron Microscope (TEM)) |
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¢ßÁö¿¤ÄÚÆÛ·¹ÀÌ¼Ç |
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Gatan model 691 |
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±Ý¼Ó ÆÇÀç ÀÎÀå¾ÐÃà½ÃÇè±â(Sheet Metal Deformation Simulator) |
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¢ß¾Ë¾Øºñ |
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RB319 |
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±ÝÇüÅ×½ºÅͱâ(U Draw Test Mold for Servo Press) |
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R&B |
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½ºÆÛÅÍ / Áø°øÁõÂø ÀåÄ¡(Sputtering / Vacuum Deposition System) |
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ö°´ëÇпø 374È£
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¼ö¼Ò·® ºÐ¼® ½Ã½ºÅÛ(Total Dissolved Solids (TDS) System for Hydrogen Analysis) |
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R-Dec |
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HTDS-003 |
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ö°´ëÇпø 435-7È£
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°í¼ÓÁÖÁ¶ ÁÖÆí ³Ã°¢ ¹× ÀÀ°í simulator(Simulator for Solidification and Cooling of a Slab during High Speed Continuous Casting) |
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ö°´ëÇпø 480È£
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¿ëÇØ¿ë À¯µµ°¡¿ ÀåÄ¡(Induction Heating System for Melting) |
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PSTEK |
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ö°´ëÇпø 584È£
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Áø°øºÐ±¤°è(Fourier Transform Infrared) |
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Bruker |
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VERTEX 80v with HYPERION 2000 |
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ö°´ëÇпø ´ëÇü½ÇÇ赿
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¹úÁö/FLC ½ÃÇè±â(Bulge/Forming Limit Curves (FLC) Tester) |
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ERICHSEN |
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Model 161 |
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ö°´ëÇпø ´ëÇü½ÇÇ赿
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Àü±âÈÇÐ ºÐ¼®±â(Electrochemical Analyzer System) |
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Advanced Measurement Technology |
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2101A |
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Çѱ¹·Îº¿À¶ÇÕ¿¬±¸¿ø 313È£
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´ÙÁß°ËÃâ À¯µµ°áÇÕÇöóÁ Áú·®ºÐ¼®±â(Multi-Collector Inductively Coupled Plasma Mass Spectrometer (MC-ICP-MS)) |
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Nu Instruments Ltd |
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Plasma 3 |
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À¯µµ °áÇÕ ÇöóÁ ºÐ±¤ºÐ¼®±â(Inductively Coupled Plasma-Optical Emission Spectrometry (ICP-OES)) |
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Thermo Scientific |
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iCAP 7400 |
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ȯ°æ°øÇе¿ 106È£
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°í¼º´É ¾×ü Å©·Î¸¶Åä±×·¡ÇÇ(High Performance Liquid Chromatograph (HPLC)) |
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Agilent Technologies |
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1260 Infinity |
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±âÆÇ ±â¹Ý ¹°Áú Á¦ÀÛ¿ë ¾Æ³ë´ÙÀÌÁî(Anodizer for AAO) |
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TERALEADER |
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TAD-001-2CH |
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Àû¿Ü¼± ºÐ±¤±â(Fourier-transform Infrared (FT-IR) Spectrometer) |
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Thermo Scientific |
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Nicolet iS50 |
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Àû¿Ü¼± ºÐ±¤±â(Fourier-transform Infrared (FT-IR) Spectrometer) |
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PerkinElmer |
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Spectrum Two |
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ȯ°æ°øÇе¿ 403È£
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Ç¥¸é ¹°¼º ÃøÁ¤±â(Force Tensiometer) |
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Kruss |
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K100 |
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ȯ°æ°øÇе¿ 403È£
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°í¼º´É ¾×ü Å©·Î¸¶Åä±×·¡ÇÇ(High Performance Liquid Chromatograph (HPLC)) |
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Waters |
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e2695 |
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ȯ°æ°øÇе¿ 412È£
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Àû¿Ü¼± ºÐ±¤±â(Fourier-transform Infrared (FT-IR) Spectrometer) |
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Thermo Scientific |
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Nicolet 6700 |
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ȯ°æ°øÇе¿ 417È£
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Àåºñ¸í |
Àû¿Ü¼± ºÐ±¤±â(Fourier-transform Infrared (FT-IR) Spectrometer) |
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Thermo Scientific |
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Nicolet iS50 |
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ȯ°æ°øÇе¿ 431È£
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Àåºñ¸í |
Àû¿Ü¼± ºÐ±¤±â(Fourier-transform Infrared (FT-IR) Spectrometer) |
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Thermo Scientific |
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Nicolet iS20 |
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