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Àú¾Ð ÈÇÐÁõÂøÀåÄ¡(ÆÛ´Ï½º ŸÀÔ)
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Àåºñ¸í(¿µ¹®) |
Low Pressure Chemical Vapor Deposition (LP-CVD; Furnace Type) |
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(ÁÖ)À¯ÁøÅ×Å© |
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BJM100 |
»ó¼¼Á¤º¸ |
Àåºñ»ç¾ç |
Standard process : SiO2, SiN(PM1), Poly-si, Phos. Doped Poly-Si(PM2)
Process Temperature : 700¡É
Process Presuure : 50 ~ 300Torr
Wafer size : up to 8inch wafer
Gases : SiH4, N2O, NH3, N2, Ar(PM1), SiH4, 0.1%PH3, NF3, N2, Ar(PM2) |
Ȱ¿ëºÐ¾ß |
SiO2 : possible to prevent for W electrode oxidation
SiN : easy controllable refractive index 1.9~2.2 for NAND flash device
Poly-si : film microstructure control(columnar, random, amorphous silicon) polycrystalline grain structure control for small, randomly-oriented grains
liner, spacer, hardmask, wet etch stopper, W capping, gate stack electrode |
Àåºñ¿î¿µÀη |
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ÃÖÂùÈ£ |
ÀüÈ |
054-279-0283 |
À̸ÞÀÏ |
chanho@postech.ac.kr |
µ¿ÀÏ/À¯»çÀåºñÁ¤º¸ |
Àåºñ¸í |
À¯¼¼Æ÷ ºÐ¼®±â(High-end performance Flow Cytometer) |
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BD Biosciences |
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LSR Foretessa 4Laser |
¼³Ä¡Àå¼Ò |
202-1È£
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|
Àåºñ¸í |
(GLOCAL)°íÇØ»óµµ ½ºÆåÆ®·³ À¯¼¼Æ÷ ºÐ¼®±â(High parameter Flow Cytometer) |
Á¦ÀÛ»ç |
BD Biosciences |
¸ðµ¨¸í |
BD FACS Symphony A5 SE |
¼³Ä¡Àå¼Ò |
202-1È£
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Àåºñ¸í |
½Ç¸®ÄÜ Ä«¹ÙÀÌµå ¹Ú½º °¡¿·Î(SiC Box Furnace) |
Á¦ÀÛ»ç |
(ÁÖ)¾ÆÀü°¡¿»ê¾÷ |
¸ðµ¨¸í |
AJ-SB1 |
¼³Ä¡Àå¼Ò |
302È£
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|
Àåºñ¸í |
ÃÊ°í¼º´É ÀÚµ¿ ¼¼Æ÷ºÐ¼®±â(Ultra High-End Performance Flow Cytometry System) |
Á¦ÀÛ»ç |
Beckman Coulter |
¸ðµ¨¸í |
cyotoFLEX LX |
¼³Ä¡Àå¼Ò |
729È£
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|
Àåºñ¸í |
Áø°ø ¿ÁõÂø ½Ã½ºÅÛ(Thermal Evaporating System) |
Á¦ÀÛ»ç |
´ëµ¿ÇÏÀÌÅØ |
¸ðµ¨¸í |
DD-GT103R |
¼³Ä¡Àå¼Ò |
C5 329È£
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|
Àåºñ¸í |
ÆÐ·²¸° ÁõÂø±â(Parylene Deposition System) |
Á¦ÀÛ»ç |
¿À¹æÅ×Å©³î·ÎÁö |
¸ðµ¨¸í |
OBT-PC300 |
¼³Ä¡Àå¼Ò |
C5 329È£
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|
Àåºñ¸í |
ÆÞ½º ·¹ÀÌÀú ÁõÂø ½Ã½ºÅÛ(Pulsed Laser Deposition (PLD) System) |
Á¦ÀÛ»ç |
ÇѺû·¹ÀÌÀú |
¸ðµ¨¸í |
GPPA-A377 |
¼³Ä¡Àå¼Ò |
C5 329È£
|
|
Àåºñ¸í |
¿ø·á ÁõÂø ½Ã½ºÅÛ(Materials Deposition System with Piezoelectric Inkjet Catridge) |
Á¦ÀÛ»ç |
FUJIFILM |
¸ðµ¨¸í |
Dimatix DMP-2850 |
¼³Ä¡Àå¼Ò |
C5 329È£
|
|
Àåºñ¸í |
ÆÐ·²¸° ÁõÂø±â(Parylene Deposition System) |
Á¦ÀÛ»ç |
Specialty Coating Systems (SCS) - A KISCO Company |
¸ðµ¨¸í |
PDS Labcoter 2 (PDS 2010 LABCOTER) |
¼³Ä¡Àå¼Ò |
C5 720-1È£
|
|
Àåºñ¸í |
3D ±¼ÀýÇö¹Ì°æ(Low coherence holotomography systems) |
Á¦ÀÛ»ç |
Tomocube |
¸ðµ¨¸í |
HT-X1 |
¼³Ä¡Àå¼Ò |
C5, 722È£(¹ÙÀÌ¿ÀÇコÄɾÅÍ)
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Àåºñ¸í |
ÀüÀÚºö ÁõÂø±â(E-beam Evaporating System) |
Á¦ÀÛ»ç |
TEMESCAL/BOC COATING TECH |
¸ðµ¨¸í |
BDJ 1800 |
¼³Ä¡Àå¼Ò |
LG¿¬±¸µ¿ 110È£
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Àåºñ¸í |
¿øÀÚÃþ ÁõÂø±â(Atomic Layer Deposition (ALD)) |
Á¦ÀÛ»ç |
CN1 |
¸ðµ¨¸í |
Atomic-Basic |
¼³Ä¡Àå¼Ò |
RIST1µ¿ 1139È£
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|
Àåºñ¸í |
ÀüÀÚºö ÁõÂø±â(E-beam Evaporating System) |
Á¦ÀÛ»ç |
Telemark |
¸ðµ¨¸í |
246-28 |
¼³Ä¡Àå¼Ò |
RIST1µ¿ 1145È£
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|
Àåºñ¸í |
±Û·Î¿ì ¹æÀü ºÐ±¤ ºÐ¼®±â(Glow Discharge Spectrometer) |
Á¦ÀÛ»ç |
LECO |
¸ðµ¨¸í |
GDS850A |
¼³Ä¡Àå¼Ò |
RIST1µ¿ 1183È£
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|
Àåºñ¸í |
±Û·Î¿ì ¹æÀü ºÐ±¤ ºÐ¼®±â(Glow Discharge Spectrometer) |
Á¦ÀÛ»ç |
LECO |
¸ðµ¨¸í |
GDS850A |
¼³Ä¡Àå¼Ò |
RIST1µ¿ 1185È£
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|
Àåºñ¸í |
±Û·Î¿ì ¹æÀü Áú·®ºÐ¼®±â(Glow Discharge Mass Spectrometry (GD-MS)) |
Á¦ÀÛ»ç |
Thermo Scientific |
¸ðµ¨¸í |
ELEMENT GD |
¼³Ä¡Àå¼Ò |
RIST1µ¿ 1302È£
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|
Àåºñ¸í |
ÀüÀÚºö ÁõÂø±â(E-beam Evaporating System) |
Á¦ÀÛ»ç |
Selcos |
¸ðµ¨¸í |
Cetus-E |
¼³Ä¡Àå¼Ò |
RIST3µ¿ 3104È£
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|
Àåºñ¸í |
¿ ÈÇÐ ±â»ó ÁõÂø ÀåÄ¡(Thermal Chemical Vapor Deposition (CVD) System) |
Á¦ÀÛ»ç |
SNTEK |
¸ðµ¨¸í |
TCS5000 |
¼³Ä¡Àå¼Ò |
RIST3µ¿ 3104È£
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|
Àåºñ¸í |
Áø°ø ¿ÁõÂø ½Ã½ºÅÛ(Thermal Evaporating System) |
Á¦ÀÛ»ç |
TERALEADER |
¸ðµ¨¸í |
TLP1001 |
¼³Ä¡Àå¼Ò |
RIST3µ¿ 3139È£
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|
Àåºñ¸í |
ÀüÀÚºö ÁõÂø±â(E-beam Evaporating System) |
Á¦ÀÛ»ç |
iNFOVION |
¸ðµ¨¸í |
- |
¼³Ä¡Àå¼Ò |
RIST3µ¿ 3147È£
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|
Àåºñ¸í |
ÇöóÁ ¿øÀÚÃþ ÁõÂø ½Ã½ºÅÛ(Plasma Enhanced Atomic Layer Deposition (PE-ALD) System) |
Á¦ÀÛ»ç |
ForALL |
¸ðµ¨¸í |
OZONE |
¼³Ä¡Àå¼Ò |
RIST3µ¿ 3223È£
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|
Àåºñ¸í |
ÆÞ½º ·¹ÀÌÀú ÁõÂø ½Ã½ºÅÛ(Pulsed Laser Deposition (PLD) System) |
Á¦ÀÛ»ç |
HIGGSLAB |
¸ðµ¨¸í |
PLD SYSTEM |
¼³Ä¡Àå¼Ò |
RIST3µ¿ 3263È£
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|
Àåºñ¸í |
ÆÞ½º ·¹ÀÌÀú ÁõÂø ½Ã½ºÅÛ(Pulsed Laser Deposition (PLD) System) |
Á¦ÀÛ»ç |
COHERENT |
¸ðµ¨¸í |
COMPex Pro 102 F |
¼³Ä¡Àå¼Ò |
RIST3µ¿ 3282È£
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|
Àåºñ¸í |
¼öÁ÷ Àü±â·Î(Vertical Tube Furnace) |
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Lenton |
¸ðµ¨¸í |
LTF 14/-/450 |
¼³Ä¡Àå¼Ò |
RIST3µ¿ 3316È£
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|
Àåºñ¸í |
X-¼±±¤ÀüÀںб¤ºÐ¼®±â(XPS xonnectable Deposition system) |
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ULVAC-PHI, Inc. |
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PHI GENESIS Multi-tech Scanning XPS |
¼³Ä¡Àå¼Ò |
RIST3µ¿ 3360/3362È£
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|
Àåºñ¸í |
Áø°ø ¿ÁõÂø ½Ã½ºÅÛ(Vacuum Thermal Evaporating System) |
Á¦ÀÛ»ç |
WOOSUNG HI-VAC |
¸ðµ¨¸í |
- |
¼³Ä¡Àå¼Ò |
RIST3µ¿ 3363È£
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|
Àåºñ¸í |
°í¼º´É À¯¼¼Æ÷ºÐ¼®±â(High Performance Flow Cytometer) |
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Becton Dickinson And Company |
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FACS Canto II |
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°¡Å縯´ë ÀÇ»ý¸í°øÇבּ¸¼Ò
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|
Àåºñ¸í |
ÃʰíÁø°øÀú¿Â ÁÖ»çÅͳθµÇö¹Ì°æ(Ultra High Vacuum Low Temperature Scanning Tunneling Microscopy (STM)) |
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Unisoku |
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USM 1200 |
¼³Ä¡Àå¼Ò |
³ª³ëÀ¶ÇÕ±â¼ú¿ø 1Ãþ 101È£
|
|
Àåºñ¸í |
°í¿Â ¿Ã³¸®·Î(High Temperature Anneal Furnace) |
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ULVAC |
¸ðµ¨¸í |
PFS-6000-25 |
¼³Ä¡Àå¼Ò |
³ª³ëÀ¶ÇÕ±â¼ú¿ø 216È£
|
|
Àåºñ¸í |
°í¿Â ¿Ã³¸®·Î(High Temperature Anneal Furnace) |
Á¦ÀÛ»ç |
ULVAC |
¸ðµ¨¸í |
PFS-6000-25 |
¼³Ä¡Àå¼Ò |
³ª³ëÀ¶ÇÕ±â¼ú¿ø 216È£
|
|
Àåºñ¸í |
Áø°ø ¿ÁõÂø ½Ã½ºÅÛ(Thermal Evaporating System) |
Á¦ÀÛ»ç |
DDONG High Technologies |
¸ðµ¨¸í |
Thermal Evaporator System |
¼³Ä¡Àå¼Ò |
³ª³ëÀ¶ÇÕ±â¼ú¿ø 311È£
|
|
Àåºñ¸í |
Àú¿¡³ÊÁö À̿ ¿¬¸¶±â(Gentle Mill (Low Energy Ion Milling System)) |
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TechnoOrg Linda |
¸ðµ¨¸í |
IV5 |
¼³Ä¡Àå¼Ò |
³ª³ëÀ¶ÇÕ±â¼ú¿ø ½ÃÆíÁغñ½Ç 312È£
|
|
Àåºñ¸í |
ÀüÀÚºö ÁõÂø±â(E-beam Evaporating System) |
Á¦ÀÛ»ç |
Korea Vacuum Tech |
¸ðµ¨¸í |
KVE-C300160 |
¼³Ä¡Àå¼Ò |
³ª³ëÀ¶ÇÕ±â¼ú¿ø Ŭ¸°·ëµ¿ 2Ãþ Ŭ¸°·ë
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|
Àåºñ¸í |
À¯±â¹° ÁõÂø±â(Organic Molecular Beam Deposition (OMBD) & Thermal Evaporator) |
Á¦ÀÛ»ç |
alpha-plus |
¸ðµ¨¸í |
OMBD & Thermal |
¼³Ä¡Àå¼Ò |
³ª³ëÀ¶ÇÕ±â¼ú¿ø Ŭ¸°·ëµ¿ 2Ãþ Ŭ¸°·ë
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|
Àåºñ¸í |
±Ý¼Ó À¯±â¹° ÈÇбâ»óÁõÂø ½Ã½ºÅÛ(Metalorganic Chemical Vapor Deposition (MOVCD) System) |
Á¦ÀÛ»ç |
Jusung Eng. |
¸ðµ¨¸í |
Eureka 2000 |
¼³Ä¡Àå¼Ò |
³ª³ëÀ¶ÇÕ±â¼ú¿ø Ŭ¸°·ëµ¿ 2Ãþ Ŭ¸°·ë
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|
Àåºñ¸í |
¿øÀÚÃþ ÁõÂø±â(Atomic Layer Deposition (ALD)) |
Á¦ÀÛ»ç |
QUROS |
¸ðµ¨¸í |
Plus 200 |
¼³Ä¡Àå¼Ò |
³ª³ëÀ¶ÇÕ±â¼ú¿ø Ŭ¸°·ëµ¿ 2Ãþ Ŭ¸°·ë
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|
Àåºñ¸í |
ÀüÀÚºö ÁõÂø±â(E-beam Evaporating System) |
Á¦ÀÛ»ç |
Korea Vacuum Tech |
¸ðµ¨¸í |
KVE-4000 |
¼³Ä¡Àå¼Ò |
³ª³ëÀ¶ÇÕ±â¼ú¿ø Ŭ¸°·ëµ¿ 2Ãþ Ŭ¸°·ë
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|
Àåºñ¸í |
ÇöóÁ ÈÇÐ ±â»ó ÁõÂø±â(Plasma Enhanced Chemical Vapor Deposition (PE-CVD)) |
Á¦ÀÛ»ç |
¾ÆÅؽýºÅÛ |
¸ðµ¨¸í |
UF-CVD 200 |
¼³Ä¡Àå¼Ò |
³ª³ëÀ¶ÇÕ±â¼ú¿ø Ŭ¸°·ëµ¿ 2Ãþ Ŭ¸°·ë
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|
Àåºñ¸í |
»ó¾Ð ÈÇбâ»óÁõÂø¹ý(Atmosphere Pressure Chemical Vapor Deposition (APCVD)) |
Á¦ÀÛ»ç |
Watkins Johnson |
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WJ-1000T |
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³ª³ëÀ¶ÇÕ±â¼ú¿ø Ŭ¸°·ëµ¿ 2Ãþ Ŭ¸°·ë
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Àåºñ¸í |
°í¿Â¿Ã³¸®¿ë V-ÆÛ´Ï½º(High Temperature Process V-Furnace) |
Á¦ÀÛ»ç |
TEL |
¸ðµ¨¸í |
Alpha-808SD |
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³ª³ëÀ¶ÇÕ±â¼ú¿ø Ŭ¸°·ëµ¿ 2Ãþ Ŭ¸°·ë
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Àåºñ¸í |
½À½Ä»êÈ¿ë V-ÆÛ´Ï½º(Wet Oxidation V-Furnace) |
Á¦ÀÛ»ç |
TEL |
¸ðµ¨¸í |
Alpha-808SD |
¼³Ä¡Àå¼Ò |
³ª³ëÀ¶ÇÕ±â¼ú¿ø Ŭ¸°·ëµ¿ 2Ãþ Ŭ¸°·ë
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Àåºñ¸í |
°Ç½Ä»êÈ¿ë V-ÆÛ´Ï½º(Dry Oxidation V-Furnace) |
Á¦ÀÛ»ç |
TEL |
¸ðµ¨¸í |
Alpha-808DN |
¼³Ä¡Àå¼Ò |
³ª³ëÀ¶ÇÕ±â¼ú¿ø Ŭ¸°·ëµ¿ 2Ãþ Ŭ¸°·ë
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|
Àåºñ¸í |
ź¼Ò³ª³ëÆ©ºê ÇÕ¼º CVD(Carbon Nanotube (CNT) Synthesis Chemical Vapor Deposition (CVD)) |
Á¦ÀÛ»ç |
¾ÆÅؽýºÅÛ |
¸ðµ¨¸í |
- |
¼³Ä¡Àå¼Ò |
³ª³ëÀ¶ÇÕ±â¼ú¿ø Ŭ¸°·ëµ¿ 2Ãþ Ŭ¸°·ë
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|
Àåºñ¸í |
ÇöóÁ ÈÇÐ ±â»ó ÁõÂø±â(Plasma Enhanced Chemical Vapor Deposition (PE-CVD)) |
Á¦ÀÛ»ç |
BMR Technology Co. |
¸ðµ¨¸í |
HiDep-SC |
¼³Ä¡Àå¼Ò |
³ª³ëÀ¶ÇÕ±â¼ú¿ø Ŭ¸°·ëµ¿ 2Ãþ Ŭ¸°·ë
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|
Àåºñ¸í |
ÀüÀÚºö ÁõÂø±â(E-beam Evaporating System) |
Á¦ÀÛ»ç |
Korea Vacuum Tech |
¸ðµ¨¸í |
KVE-C300160 |
¼³Ä¡Àå¼Ò |
³ª³ëÀ¶ÇÕ±â¼ú¿ø Ŭ¸°·ëµ¿ 2Ãþ Ŭ¸°·ë
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|
Àåºñ¸í |
º¸È£¸·¿ë ÇöóÁ ÈÇÐ ±â»ó ÁõÂø±â(Plasma Enhanced Chemical Vapor Deposition (PE-CVD) for Passivation) |
Á¦ÀÛ»ç |
TES |
¸ðµ¨¸í |
TELIA200 |
¼³Ä¡Àå¼Ò |
³ª³ëÀ¶ÇÕ±â¼ú¿ø Ŭ¸°·ëµ¿ 2Ãþ Ŭ¸°·ë
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Àåºñ¸í |
¼öÁ÷È®»êÀü±â·Î(Vertical Pyro Furnace) |
Á¦ÀÛ»ç |
(ÁÖ)¸®µå¿£Áö´Ï¾î¸µ |
¸ðµ¨¸í |
VULCAN-V81RD |
¼³Ä¡Àå¼Ò |
³ª³ëÀ¶ÇÕ±â¼ú¿ø Ŭ¸°·ëµ¿ 2Ãþ Ŭ¸°·ë
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|
Àåºñ¸í |
ÇöóÁ ÈÇÐ ±â»ó ÁõÂø±â(Plasma Enhanced Chemical Vapor Deposition (PE-CVD)) |
Á¦ÀÛ»ç |
Korea Vacuum Tech |
¸ðµ¨¸í |
KVPED-T0583 |
¼³Ä¡Àå¼Ò |
Á¦1°øÇаü 210È£
|
|
Àåºñ¸í |
Áø°ø ¿ÁõÂø ½Ã½ºÅÛ(Thermal Evaporating System) |
Á¦ÀÛ»ç |
GD-Tech |
¸ðµ¨¸í |
KVT-2008L |
¼³Ä¡Àå¼Ò |
Á¦1°øÇаü 210È£
|
|
Àåºñ¸í |
ÀúÁØÀ§ ¾×ü¼¶±¤ºÐ¼®±â(Low Activity Liquid Scintillation Analyzer) |
Á¦ÀÛ»ç |
PerkinElmer |
¸ðµ¨¸í |
Tri-Carb 5110 TR |
¼³Ä¡Àå¼Ò |
Á¦1½ÇÇ赿 318È£
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|
Àåºñ¸í |
¸ð¼¼°üÇü°¡¿·Î(Capillary Furnace System) |
Á¦ÀÛ»ç |
Malvern Instruments |
¸ðµ¨¸í |
Rosand RH7 |
¼³Ä¡Àå¼Ò |
Á¦5°øÇаü 206È£
|
|
Àåºñ¸í |
Áø°ø-°¡¾Ð ¿ëÇØ ¹× ¿¬¼ÓÁÖÁ¶ÀåÄ¡(Vacuum-over Pressure Continuous Casting Machine) |
Á¦ÀÛ»ç |
¢ßÄÉÀÌ¿¡ÀÌ¿¥¾ÆÀÌ |
¸ðµ¨¸í |
VCC 1000 (indutherm) |
¼³Ä¡Àå¼Ò |
ö°´ëÇпø 272È£
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|
Àåºñ¸í |
¾ÆÅ©¿ëÇØ·Î(Arc Melting Furnace) |
Á¦ÀÛ»ç |
¾ÆÀ̾¾Æ¼ |
¸ðµ¨¸í |
KHAM-500 |
¼³Ä¡Àå¼Ò |
ö°´ëÇпø 374È£
|
|
Àåºñ¸í |
½ºÆÛÅÍ / Áø°øÁõÂø ÀåÄ¡(Sputtering / Vacuum Deposition System) |
Á¦ÀÛ»ç |
¾ÆÀ̾¾Æ¼ |
¸ðµ¨¸í |
Ư¼öÁ¦ÀÛ |
¼³Ä¡Àå¼Ò |
ö°´ëÇпø 374È£
|
|
Àåºñ¸í |
°í¿Â¿Ã³¸® Àü±â·Î(Tube Furnace) |
Á¦ÀÛ»ç |
Lenton |
¸ðµ¨¸í |
Lenton 1500 PTF-15/100/610 |
¼³Ä¡Àå¼Ò |
ö°´ëÇпø 380È£
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|
Àåºñ¸í |
°íÁø°ø·Î(High Vacuum Furnace) |
Á¦ÀÛ»ç |
¿¡ÀÌÆ¼¿¡ÇÁ(ATF) |
¸ðµ¨¸í |
Ư¼öÁ¦ÀÛ |
¼³Ä¡Àå¼Ò |
ö°´ëÇпø 380È£
|
|
Àåºñ¸í |
°í¼Ó°¡¿·Î(High Temperature Rate Furnace) |
Á¦ÀÛ»ç |
¾ÆÀ̾¾Æ¼ |
¸ðµ¨¸í |
Ư¼öÁ¦ÀÛ |
¼³Ä¡Àå¼Ò |
ö°´ëÇпø 380È£
|
|
Àåºñ¸í |
±Ý¼Ó Żź ¿Ã³¸® ½Ã½ºÅÛ(Tube Type Furnace System) |
Á¦ÀÛ»ç |
¢ßº£½º |
¸ðµ¨¸í |
Ư¼öÁ¦ÀÛ |
¼³Ä¡Àå¼Ò |
ö°´ëÇпø 380È£
|
|
Àåºñ¸í |
IET ¸ôµåÇ÷°½º ½Ã·á Á¦Á¶ ÀåÄ¡(High Frequency Induction Furnacer) |
Á¦ÀÛ»ç |
¿¤ÅØ |
¸ðµ¨¸í |
Ư¼öÁ¦ÀÛ |
¼³Ä¡Àå¼Ò |
ö°´ëÇпø 480È£
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Àåºñ¸í |
°í¿Â°¡¿·Î(Image Furnace System) |
Á¦ÀÛ»ç |
ULVAC |
¸ðµ¨¸í |
MR-39H/D |
¼³Ä¡Àå¼Ò |
ö°´ëÇпø 546È£
|
|
Àåºñ¸í |
µµ°¡´Ï ºÎÇÏ ½Ã½ºÅÛ(1600 ¡ÆC Furnace Crucible Leading System) |
Á¦ÀÛ»ç |
Lenton |
¸ðµ¨¸í |
LTF-16/75/610 |
¼³Ä¡Àå¼Ò |
ö°´ëÇпø 546È£
|
|
Àåºñ¸í |
±Þ¼Ó°¡¿ÀåÄ¡(Infrared Gold Image Furnace) |
Á¦ÀÛ»ç |
ÅäÅ»¼Ö·ç¼Ç°úÇÐ |
¸ðµ¨¸í |
VHT-E44 |
¼³Ä¡Àå¼Ò |
ö°´ëÇпø 546È£
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Àåºñ¸í |
Àú¿ÂȸȷÎ(Low Temperature Furnace) |
Á¦ÀÛ»ç |
Lenton |
¸ðµ¨¸í |
LTF-175/80/350 |
¼³Ä¡Àå¼Ò |
ö°´ëÇпø 576È£
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|
Àåºñ¸í |
¼öÁ÷ȸȷÎ(Vertical Furnace) |
Á¦ÀÛ»ç |
Lenton |
¸ðµ¨¸í |
LTF 17/75/30 |
¼³Ä¡Àå¼Ò |
ö°´ëÇпø 584È£
|
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Àåºñ¸í |
Àú¿ÂȸȷÎ(Low Temperature Furnace) |
Á¦ÀÛ»ç |
Lenton |
¸ðµ¨¸í |
LTF-17/75/300 |
¼³Ä¡Àå¼Ò |
ö°´ëÇпø 584È£
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|
Àåºñ¸í |
°í¿Â ¼öÁ÷ Àü±â·Î(Vertical Tube Furnace) |
Á¦ÀÛ»ç |
Lenton |
¸ðµ¨¸í |
Lenton LTF-175/80/350 |
¼³Ä¡Àå¼Ò |
ö°´ëÇпø 584È£
|
|
Àåºñ¸í |
°í¿Â ¼öÁ÷ Àü±â·Î(Vertical Tube Furnace) |
Á¦ÀÛ»ç |
Lenton |
¸ðµ¨¸í |
Lenton LTF-175/80/350 |
¼³Ä¡Àå¼Ò |
ö°´ëÇпø 584È£
|
|
Àåºñ¸í |
¿°¿å·Î(Furnace Salt Bath) |
Á¦ÀÛ»ç |
Lenton |
¸ðµ¨¸í |
LSBF-10/45 |
¼³Ä¡Àå¼Ò |
ö°´ëÇпø ´ëÇü½ÇÇ赿
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|
Àåºñ¸í |
°íÁÖÆÄ À¯µµ °¡¿ ¿ëÇØ·Î(Vacuum Induction Melting and Casting Furnace) |
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ALD Vacuum Technologies |
¸ðµ¨¸í |
VIM4 |
¼³Ä¡Àå¼Ò |
ö°´ëÇпø ´ëÇü½ÇÇ赿
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|
Àåºñ¸í |
1400 ¡ÆC ¼öÁ÷ Æ©ºê ¿Ã³¸® Àåºñ(1400 ¡ÆC Tube furnace) |
Á¦ÀÛ»ç |
Lenton |
¸ðµ¨¸í |
LTF-14/75/610 |
¼³Ä¡Àå¼Ò |
ö°´ëÇпø ´ëÇü½ÇÇ赿
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|
Àåºñ¸í |
Àü±âÈÇÐ ºÐ¼®±â(Electrochemical Analyzer System) |
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Advanced Measurement Technology |
¸ðµ¨¸í |
2101A |
¼³Ä¡Àå¼Ò |
Çѱ¹·Îº¿À¶ÇÕ¿¬±¸¿ø 313È£
|
|
Àåºñ¸í |
À¯¼¼Æ÷ºÐ¼®±â(Flow Cytometer) |
Á¦ÀÛ»ç |
Beckman Coulter |
¸ðµ¨¸í |
B75442 |
¼³Ä¡Àå¼Ò |
ȯ°æ°øÇе¿ 327È£
|
|
Àåºñ¸í |
TFF ½Ã½ºÅÛ(Tangential Flow Filtration (TFF) System) |
Á¦ÀÛ»ç |
MERCK |
¸ðµ¨¸í |
Cogent M1 TFF System |
¼³Ä¡Àå¼Ò |
ȯ°æ°øÇе¿ 331È£
|
|
Àåºñ¸í |
À¯Ã¼È帧Á¤Áö ºÐ±¤±¤µµ°è(Stopped-flow Spectrometer) |
Á¦ÀÛ»ç |
AppliedPhotophysics |
¸ðµ¨¸í |
SX20 |
¼³Ä¡Àå¼Ò |
ȯ°æ°øÇе¿ 334È£
|