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10048175 |
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I&A TECHNOLOGY INC. |
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3D Profiler |
Àåºñ»ç¾ç |
1. SYSTEM - Measurement Techniques : optical phase -shifting and white light vertical scanning interferometry - Measurement Capability : three - dimensional, non - contact, surface profile measurements - Objectives : 1.5X, 2.5X, 5.0X, 10X, 20X, 50X optional manual turret - Field-of -View Lenses : 0.5X, 0.75X, 1.0X, 1.5X, 2.0X - Measurement Array : user- selectable, maximum array 736 x 480 - Light Source : tungsten halogen lamp (user- replaceable) manual filter selection - Stages : manual; ¡¾50.8 mm X/Y translation, ¡¾4¡Æ tip/tilt; optional automated stitching stage, ¡¾50.8 mm X/Y - Optical Assembly : integrated illuminator; interchangeable discrete field-of-view lenses; closed-loop precision vertical scanning assembly - Video Display : 127mm monochrome monitor - Computer System : PC with latest Celeron processor, 17 inch SVGA monitor; optional printers and network cards - Software : Wyko Vision32 software running under Microsoft Windows XP 2. PERFORMANCE - Vertical Measurement Range : 0.1 nm to 1 mm - Vertical Resolution : < 1 Ra - RMS Repeatability : 0.01 nm - Vertical Scan Speed : up to 7.2 ¥ìm/sec (288 ¥ìin./sec) - Lateral Spatial Sampling : 0.08 to 13.1¥ìm - Field-of -View : 8.24 mm to 0.05 mm (larger areas with Data Stitching option) - Reflectivity : 1% to 100% 3. ENVIRONMENT - Temperature Range : between 15 and 30 ¡ÆC - Humidity Range : ¡Â 80%, non-condensing - Vibration : optional isolation system (recommended) 4. DIMENSIONS - Microscope : 399 mm W x 508 mm D x 737 mm H 5. WEIGHT - Microscope : does not exceed 56.7 kg - Shipping Weight : 204.1 kg 6. POWER REQUIREMENTS - Input Voltage : user- selectable 100 -120 VAC/200?240 VAC, 50-60 Hz - Power Consumption : < 300W - Compressed Air : 4.2 - 7.0 kg/cm (60?100 PSI ) for optional isolation system |
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ºñÁ¢ÃË½Ä 3Â÷¿ø ±¸Á¶ºÐ¼® |
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±è¼ö°ï |
ÀüÈ |
054-279-0227 |
À̸ÞÀÏ |
sukoni@postech.ac.kr |
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MJP ¹æ½Ä 3D ÇÁ¸°ÅÍ(3D Printer with Multi Jetting Printing (MJP) Technology) |
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3D SYSTEMS |
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ProJet MJP 2500 |
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|
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3D ¹ÙÀÌ¿À ÇÁ¸°ÅÍ(3D Bioprinter) |
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T&R Biofab |
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- |
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|
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3D ÇÁ¸°ÅÍ(Standalone 3D printer system) |
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3D Systems |
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Figure 4 Standalone 3D Printer |
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|
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Ç¥¸é´ÜÂ÷ÃøÁ¤±â(Surface Profiler) |
Á¦ÀÛ»ç |
Veeco |
¸ðµ¨¸í |
Dektak 150 |
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|
Àåºñ¸í |
3D º¯ÇüÃøÁ¤½Ã½ºÅÛ(3D Deformation Analysis System) |
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GOM international AG |
¸ðµ¨¸í |
ARAMIS 12M |
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|
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¹Ú¸·ÃøÁ¤±â(Thin Film Measurement System) |
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KSV INSTRUMENTS |
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- |
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|
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3D ¿øÀÚÇö¹Ì°æ(3D Atom Probe) |
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CAMECA Instruments |
¸ðµ¨¸í |
LA-WATAP |
¼³Ä¡Àå¼Ò |
|
Àåºñ¸í |
3D Ç¥¸éÃøÁ¤ ½Ã½ºÅÛ(3D Optical Surface Metrology System) |
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Leica Microsystems |
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DCM 3D |
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|
Àåºñ¸í |
Á¢ÃË½Ä Ç¥¸é ´ÜÂ÷ÃøÁ¤±â(Contact Surface Profiler) |
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KLA Tencor |
¸ðµ¨¸í |
D-600 |
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|
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[±Û·ÎÄÃ] 3D·¹Áø ÇÁ¸°ÅÍ +¼¼Ã´±â ¼¼Æ®([Glocal] 3D Resin Printer + Washing Machine Set) |
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¿¡ÀÌÆå½º¾²¸®µð(APEX3D) |
¸ðµ¨¸í |
Form 4L Complete Package |
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|
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Ç¥¸é´ÜÂ÷ÃøÁ¤±â(Alpha Step Surface Profiler) |
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KLA TENCOR CORP. |
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Alpha-step 500 |
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|
Àåºñ¸í |
±¤ÇÐ½Ä 3Â÷¿ø ºñÁ¢ÃË ½ºÄ³³Ê(Optical 3D Scanner) |
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FARO |
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Focus 3D S120 |
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|
Àåºñ¸í |
ºñÁ¢ÃË½Ä 3Â÷¿ø ½ºÄ³³Ê(Structured-light 3D Scanner) |
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Breuckmann |
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SmartSCAN3D-HE |
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|
Àåºñ¸í |
3D ÇÁ¸°ÅÍ(3D Printer) |
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Stratasys |
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Objet Eden260V |
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|
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3D ÇÁ¸°ÅÍ(3D Printer) |
Á¦ÀÛ»ç |
(ÁÖ)ÇÁ·ÎÅäÅØ |
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Dimension SST 1200es |
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|
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³ª³ë Ç¥¸é ÇÁ·ÎÆÄÀÏ·¯(Nano Surface Profiler) |
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³ª³ë½Ã½ºÅÛ¢ß |
¸ðµ¨¸í |
NanoScan-E1000(P) |
¼³Ä¡Àå¼Ò |
|
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Áý¼Ó À̿ºö(3Â÷¿ø-EBSD)(Focused Ion Beam (FIB; 3D-EBSD)) |
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FEI |
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Quanta 3D FEG |
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|
Àåºñ¸í |
3D Àç·á ºÐ¼®(3D Materials Analysis) |
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UES, INC |
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Robo-Met. 3D Version 2 |
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|
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3Â÷¿ø¼¼Æ÷ÇÁ¸°ÅÍ(3D Bioprinter) |
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T&R Biofab |
¸ðµ¨¸í |
DX-Printer |
¼³Ä¡Àå¼Ò |
|
Àåºñ¸í |
3Â÷¿ø¼¼Æ÷ÇÁ¸°ÅÍ(3D Bioprinter) |
Á¦ÀÛ»ç |
T&R Biofab |
¸ðµ¨¸í |
DX-Printer |
¼³Ä¡Àå¼Ò |
|
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3D ¹ÙÀÌ¿ÀÇÁ¸°ÅÍ(Extrusion-based 3D Bioprinter) |
Á¦ÀÛ»ç |
CELLINK |
¸ðµ¨¸í |
BIO X |
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|
Àåºñ¿ÀÇ¿©ºÎ |
¡Û |
ÀÚÀ²»ç¿ë¿©ºÎ |
¡Û |
»ç¿ë·á |
30,000 ¿ø/ȸ (±âº»Ç¥:30,000¿ø) |
Ãëµæ±Ý¾× |
\ 97,939,687 |
ÃëµæÀÏ |
2007-01-26 |
÷ºÎÆÄÀÏ |
|
URL |
http://ppewww.physics.gla.ac.uk/~williamc/NT1100_spec.pdf |
| Profiler, Ra, non contact | |